Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9171823 | Circuit module with multiple submodules | KahWee Gan | 2015-10-27 |
| 8916481 | Embedded wafer level package for 3D and package-on-package applications, and method of manufacture | Kah Wee Gan, Yonggang Jin | 2014-12-23 |
| 8860228 | Electronic device including electrically conductive vias having different cross-sectional areas and related methods | Yonggang Jin, Yun Liu | 2014-10-14 |
| 8822267 | System in package manufacturing method using wafer-to-wafer bonding | How Yuan Hwang, Jay Maghirang, Kim-Yong Goh, Phone Maw Hla, Edmond Soon | 2014-09-02 |
| 8779601 | Embedded wafer level package for 3D and package-on-package applications, and method of manufacture | Kah Wee Gan, Yonggang Jin | 2014-07-15 |
| 8766422 | Through hole via filling using electroless plating | Kah Wee Gan, Yonggang Jin, Yun Liu | 2014-07-01 |
| 8617987 | Through hole via filling using electroless plating | Kah Wee Gan, Yonggang Jin, Yun Liu | 2013-12-31 |