Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9171823 | Circuit module with multiple submodules | Yaohuang Huang | 2015-10-27 |
| 8492181 | Embedded wafer level optical package structure and manufacturing method | Anandan Ramasamy, Hk Looi, David Gani | 2013-07-23 |