Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742283 | Integrated thin film resistor and memory device | Benfu Lin, Yun Ling Tan | 2023-08-29 |
| 11335635 | Thin film resistors of semiconductor devices | Benfu Lin, Cing Gie Lim, Chengang Feng | 2022-05-17 |
| 10468457 | Magnetic random access memory structures and integrated circuits with cobalt anti-parallel layers, and methods for fabricating the same | Dinggui Zeng, Kazutaka Yamane | 2019-11-05 |
| 9842989 | Magnetic memory with high thermal budget | Taiebeh Tahmasebi, Chim Seng Seet | 2017-12-12 |
| 9318459 | Through via package | How Yuan Hwang | 2016-04-19 |
| 8922013 | Through via package | How Yuan Hwang | 2014-12-30 |
| 8916481 | Embedded wafer level package for 3D and package-on-package applications, and method of manufacture | Yaohuang Huang, Yonggang Jin | 2014-12-23 |
| 8912653 | Plasma treatment on semiconductor wafers | Yonggang Jin, Anandan Ramasamy, Yun Liu | 2014-12-16 |
| 8779601 | Embedded wafer level package for 3D and package-on-package applications, and method of manufacture | Yaohuang Huang, Yonggang Jin | 2014-07-15 |
| 8766422 | Through hole via filling using electroless plating | Yonggang Jin, Yun Liu, Yaohuang Huang | 2014-07-01 |
| 8728831 | Reconstituted wafer warpage adjustment | Yonggang Jin | 2014-05-20 |
| 8617987 | Through hole via filling using electroless plating | Yonggang Jin, Yun Liu, Yaohuang Huang | 2013-12-31 |