Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9841399 | Chemical sensor package for highly pressured environment | Daniel Rhee Min Woo, Vivek Chidambaram, Yuen Sing Chan, Eva Leong Ching Wai, Jong Bum Lee | 2017-12-12 |
| 9431315 | Chemical sensor package for highly pressured environment | Daniel Rhee Min Woo, Vivek Chidambaram, Yuen Sing Chan, Eva Leong Ching Wai, Jong Bum Lee | 2016-08-30 |
| 9318459 | Through via package | Kah Wee Gan | 2016-04-19 |
| 8922013 | Through via package | Kah Wee Gan | 2014-12-30 |
| 8836117 | Electronic device having a contact recess and related methods | Yonggang Jin | 2014-09-16 |
| 8822267 | System in package manufacturing method using wafer-to-wafer bonding | Jay Maghirang, Yaohuang Huang, Kim-Yong Goh, Phone Maw Hla, Edmond Soon | 2014-09-02 |