Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134607 | Method for low temperature bonding of wafers | Sunil Wickramanayaka, Jinghui Xu, Zhipeng DING, Li Yan SIOW | 2018-11-20 |
| 9841399 | Chemical sensor package for highly pressured environment | Daniel Rhee Min Woo, How Yuan Hwang, Yuen Sing Chan, Eva Leong Ching Wai, Jong Bum Lee | 2017-12-12 |
| 9431315 | Chemical sensor package for highly pressured environment | Daniel Rhee Min Woo, How Yuan Hwang, Yuen Sing Chan, Eva Leong Ching Wai, Jong Bum Lee | 2016-08-30 |
| 9240362 | Layer arrangement and a wafer level package comprising the layer arrangement | Ling Xie, Ranganathan Nagarajan, Bangtao Chen, Beng Yeung Ho | 2016-01-19 |