Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134607 | Method for low temperature bonding of wafers | Vivek Chidambaram, Sunil Wickramanayaka, Jinghui Xu, Zhipeng DING | 2018-11-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134607 | Method for low temperature bonding of wafers | Vivek Chidambaram, Sunil Wickramanayaka, Jinghui Xu, Zhipeng DING | 2018-11-20 |