Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508619 | Electrical connection structure and method of forming the same | Hongyu Li, Ling Xie, Ser Choong Chong | 2022-11-22 |
| 10249593 | Method for bonding a chip to a wafer | Ling Xie, Jerry Jie Li Aw | 2019-04-02 |
| 10134607 | Method for low temperature bonding of wafers | Vivek Chidambaram, Jinghui Xu, Zhipeng DING, Li Yan SIOW | 2018-11-20 |
| 9613928 | Method and apparatus for chip-to-wafer integration | — | 2017-04-04 |
| 8986522 | Angled sputtering physical vapor deposition apparatus with wafer holder and wafer holder for an angled sputtering physical vapor deposition apparatus | — | 2015-03-24 |
| 7848077 | Electrostatic chuck device | Shigeru Mizuno, Masahito Ishihara, Naoki Miyazaki | 2010-12-07 |
| 7816283 | Method of depositing a higher permittivity dielectric film | Naoki Yamada | 2010-10-19 |
| 7791857 | Electrostatic chuck device | Shigeru Mizuno, Masahito Ishihara, Naoki Miyazaki | 2010-09-07 |
| 7724493 | Electrostatic chuck device | Shigeru Mizuno, Masahito Ishihara, Naoki Miyazaki | 2010-05-25 |
| 7625472 | Plasma-assisted sputter deposition system | — | 2009-12-01 |
| 7623334 | Electrostatic chuck device | Shigeru Mizuno, Masahito Ishihara, Naoki Miyazaki | 2009-11-24 |
| 7164571 | Wafer stage with a magnet | Yoshikazu Nozaki | 2007-01-16 |
| 7159537 | Device for fixing a gas showerhead or target plate to an electrode in plasma processing systems | Masahito Ishihara, Yoshikazu Nozaki, Hiroshi Doi | 2007-01-09 |
| 6462482 | Plasma processing system for sputter deposition applications | Yukito Nakagawa | 2002-10-08 |
| 6333601 | Planar gas introducing unit of a CCP reactor | — | 2001-12-25 |
| 6225746 | Plasma processing system | — | 2001-05-01 |
| 6216632 | Plasma processing system | — | 2001-04-17 |
| 5962083 | Methods of depositing films on polymer substrates | Yoshinori Hatanaka, Yoichiro Nakanishi, Keiichiro Sano, Masaya Nomura, Shigekazu Hayashi | 1999-10-05 |