| 11508619 |
Electrical connection structure and method of forming the same |
Hongyu Li, Ling Xie, Ser Choong Chong |
2022-11-22 |
| 10249593 |
Method for bonding a chip to a wafer |
Ling Xie, Jerry Jie Li Aw |
2019-04-02 |
| 10134607 |
Method for low temperature bonding of wafers |
Vivek Chidambaram, Jinghui Xu, Zhipeng DING, Li Yan SIOW |
2018-11-20 |
| 9613928 |
Method and apparatus for chip-to-wafer integration |
— |
2017-04-04 |
| 8986522 |
Angled sputtering physical vapor deposition apparatus with wafer holder and wafer holder for an angled sputtering physical vapor deposition apparatus |
— |
2015-03-24 |
| 7848077 |
Electrostatic chuck device |
Shigeru Mizuno, Masahito Ishihara, Naoki Miyazaki |
2010-12-07 |
| 7816283 |
Method of depositing a higher permittivity dielectric film |
Naoki Yamada |
2010-10-19 |
| 7791857 |
Electrostatic chuck device |
Shigeru Mizuno, Masahito Ishihara, Naoki Miyazaki |
2010-09-07 |
| 7724493 |
Electrostatic chuck device |
Shigeru Mizuno, Masahito Ishihara, Naoki Miyazaki |
2010-05-25 |
| 7625472 |
Plasma-assisted sputter deposition system |
— |
2009-12-01 |
| 7623334 |
Electrostatic chuck device |
Shigeru Mizuno, Masahito Ishihara, Naoki Miyazaki |
2009-11-24 |
| 7164571 |
Wafer stage with a magnet |
Yoshikazu Nozaki |
2007-01-16 |
| 7159537 |
Device for fixing a gas showerhead or target plate to an electrode in plasma processing systems |
Masahito Ishihara, Yoshikazu Nozaki, Hiroshi Doi |
2007-01-09 |
| 6462482 |
Plasma processing system for sputter deposition applications |
Yukito Nakagawa |
2002-10-08 |
| 6333601 |
Planar gas introducing unit of a CCP reactor |
— |
2001-12-25 |
| 6225746 |
Plasma processing system |
— |
2001-05-01 |
| 6216632 |
Plasma processing system |
— |
2001-04-17 |
| 5962083 |
Methods of depositing films on polymer substrates |
Yoshinori Hatanaka, Yoichiro Nakanishi, Keiichiro Sano, Masaya Nomura, Shigekazu Hayashi |
1999-10-05 |