Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11799440 | Packaging structure and method of acoustic device | Qin REN, Bowoon SOON, Bangtao Chen, Liyan Siow, Weiliang Teo +3 more | 2023-10-24 |
| 10134607 | Method for low temperature bonding of wafers | Vivek Chidambaram, Sunil Wickramanayaka, Jinghui Xu, Li Yan SIOW | 2018-11-20 |