Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11799440 | Packaging structure and method of acoustic device | Zhipeng DING, Qin REN, Bowoon SOON, Liyan Siow, Weiliang Teo +3 more | 2023-10-24 |
| 9240362 | Layer arrangement and a wafer level package comprising the layer arrangement | Vivek Chidambaram, Ling Xie, Ranganathan Nagarajan, Beng Yeung Ho | 2016-01-19 |