Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10354934 | Semiconductor packages and methods of packaging semiconductor devices | Nathapong Suthiwongsunthorn, Antonio Jr. Bambalan Dimaano, Rui Huang, Hua Tan, Kriangsak Sae Le +3 more | 2019-07-16 |
| 9978658 | Semiconductor packages and methods of packaging semiconductor devices | Nathapong Suthiwongsunthorn, Antonio Jr. Bambalan Dimaano, Rui Huang, Hua Tan, Kriangsak Sae Le +3 more | 2018-05-22 |
| 9741619 | Methods for singulating semiconductor wafer | William John Nelson, Nathapong Suthiwongsunthorn, Poh Leng Wilson Ong | 2017-08-22 |
| 9570314 | Methods for singulating semiconductor wafer | William John Nelson, Nathapong Suthiwongsunthorn, Poh Leng Wilson Ong | 2017-02-14 |
| 9508623 | Semiconductor packages and methods of packaging semiconductor devices | Nathapong Suthiwongsunthorn, Antonio Jr. Bambalan Dimaano, Rui Huang, Hua Tan, Kriangsak Sae Le +3 more | 2016-11-29 |
| 9240362 | Layer arrangement and a wafer level package comprising the layer arrangement | Vivek Chidambaram, Ling Xie, Ranganathan Nagarajan, Bangtao Chen | 2016-01-19 |