Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10403592 | Semiconductor packages and methods of packaging semiconductor devices | Yongbo Yang, Chun Hong Wo | 2019-09-03 |
| 10354934 | Semiconductor packages and methods of packaging semiconductor devices | Nathapong Suthiwongsunthorn, Rui Huang, Hua Tan, Kriangsak Sae Le, Beng Yeung Ho +3 more | 2019-07-16 |
| 9978658 | Semiconductor packages and methods of packaging semiconductor devices | Nathapong Suthiwongsunthorn, Rui Huang, Hua Tan, Kriangsak Sae Le, Beng Yeung Ho +3 more | 2018-05-22 |
| 9960130 | Reliable interconnect | Rui Huang, Chun Hong Wo | 2018-05-01 |
| 9786625 | Semiconductor packages and methods of packaging semiconductor devices | Yongbo Yang, Chun Hong Wo | 2017-10-10 |
| 9508623 | Semiconductor packages and methods of packaging semiconductor devices | Nathapong Suthiwongsunthorn, Rui Huang, Hua Tan, Kriangsak Sae Le, Beng Yeung Ho +3 more | 2016-11-29 |
| 9087777 | Semiconductor packages and methods of packaging semiconductor devices | Yongbo Yang, Chun Hong Wo | 2015-07-21 |