YY

Yongbo Yang

UC United Test And Assembly Center: 3 patents #14 of 65Top 25%
📍 Singapore, SG: #2,988 of 13,971 inventorsTop 25%
Overall (All Time): #1,498,726 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
10403592 Semiconductor packages and methods of packaging semiconductor devices Antonio Jr. Bambalan Dimaano, Chun Hong Wo 2019-09-03
9786625 Semiconductor packages and methods of packaging semiconductor devices Antonio Jr. Bambalan Dimaano, Chun Hong Wo 2017-10-10
9087777 Semiconductor packages and methods of packaging semiconductor devices Antonio Jr. Bambalan Dimaano, Chun Hong Wo 2015-07-21