Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11671686 | Camera module subcomponents attached via vertically-spread adhesive | Ng Chin Chuan, Howell John Chua Toc, Ariel B. Hontiveros | 2023-06-06 |
| 8822267 | System in package manufacturing method using wafer-to-wafer bonding | How Yuan Hwang, Yaohuang Huang, Kim-Yong Goh, Phone Maw Hla, Edmond Soon | 2014-09-02 |