Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11671686 | Camera module subcomponents attached via vertically-spread adhesive | Jay Maghirang, Ng Chin Chuan, Ariel B. Hontiveros | 2023-06-06 |
| 11128786 | Bending a circuit-bearing die | Prakash Venkatesappa, Annabelle Q. Yang, Melvin C. Cabonegro | 2021-09-21 |
| 10447900 | Camera module design with lead frame and plastic moulding | Annabelle Q. Yang, Prakash Venkatesappa, Kolan Ravi Kanth | 2019-10-15 |
| 10171713 | Method of aligning lens optical axis to image sensor plane without active alignment | Iain A. McAllister, Steven Webster | 2019-01-01 |
| 9443819 | Clamping mechanism for processing of a substrate within a substrate carrier | Gerard Anthony C. Afable, Prakash Venkatesappa, Kok Peng Teo, Annabelle Q. Yang | 2016-09-13 |