Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10447900 | Camera module design with lead frame and plastic moulding | Annabelle Q. Yang, Howell John Chua Toc, Prakash Venkatesappa | 2019-10-15 |
| 8039951 | Thermally enhanced semiconductor package and method of producing the same | Danny Retuta, Hien Boon Tan, Anthony Sun-Yi Sheng, Susanto Tanary, Patrick Low Tse Hoong | 2011-10-18 |