Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842792 | Method of producing a semiconductor package | Hien Boon Tan, Anthony Yi Sheng Sun, Mary Annie Cheong | 2017-12-12 |
| 9281218 | Method of producing a semiconductor package | Hien Boon Tan, Anthony Yi Sheng Sun, Mary Annie Cheong | 2016-03-08 |
| 8039951 | Thermally enhanced semiconductor package and method of producing the same | Kolan Ravi Kanth, Hien Boon Tan, Anthony Sun-Yi Sheng, Susanto Tanary, Patrick Low Tse Hoong | 2011-10-18 |
| 8030768 | Semiconductor package with under bump metallization aligned with open vias | Roel Adeva Robles, Mary Annie Cheong, Hien Boon Tan, Anthony Yi Sheng Sun, Richard Te Gan | 2011-10-04 |
| 7476569 | Leadframe enhancement and method of producing a multi-row semiconductor package | Hien Boon Tan, Susanto Tanary, Anthony Yi Sheng Sun, Soon Huat Tan | 2009-01-13 |
| 7375416 | Leadframe enhancement and method of producing a multi-row semiconductor package | Hien Boon Tan, Susanto Tanary, Anthony Yi Sheng Sun, Soon Huat Tan | 2008-05-20 |