Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7361995 | Molded high density electronic packaging structure for high performance applications | Kim-Yong Goh, Rahul Kapoor, Anthony Yi Sheng Sun, Lan H. Hoang | 2008-04-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7361995 | Molded high density electronic packaging structure for high performance applications | Kim-Yong Goh, Rahul Kapoor, Anthony Yi Sheng Sun, Lan H. Hoang | 2008-04-22 |