XZ

Xueren Zhang

SS Stmicroelectronics Sa: 11 patents #2,729 of 4,662Top 60%
SP Stmicroelectronics Asia Pacific Pte: 4 patents #64 of 341Top 20%
S( Stmicroelectronics (Malta): 3 patents #9 of 49Top 20%
NU Nanyang Technological University: 2 patents #168 of 1,285Top 15%
📍 Singapore, SG: #478 of 13,971 inventorsTop 4%
Overall (All Time): #346,763 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #TitleCo-InventorsDate
10658238 Semiconductor packages having an electric device with a recess Kim-Yong Goh, Yiyi Ma 2020-05-19
9824924 Semiconductor packages having an electric device with a recess Kim-Yong Goh, Yiyi Ma 2017-11-21
9679870 Integrated circuit device with shaped leads and method of forming the device Yiyi Ma, Kim-Yong Goh, Wei Zhen Goh 2017-06-13
9620438 Electronic device with heat dissipater Roseanne Duca, Valter Motta, Kim-Yong Goh 2017-04-11
9576912 Wafer level chip scale package (WLCSP) having edge protection Yiyi Ma, Kim-Yong Goh 2017-02-21
9449912 Integrated circuit (IC) card having an IC module and reduced bond wire stress and method of forming Kim-Yong Goh, Roseanne Duca 2016-09-20
9379034 Method of making an electronic device including two-step encapsulation and related devices Kim-Yong Goh, Yiyi Ma 2016-06-28
9257372 Surface mount package for a semiconductor integrated device, related assembly and manufacturing process Roseanne Duca, Kim-Yong Goh, Kevin Formosa 2016-02-09
8800391 Piezo-resistive force sensor with bumps on membrane structure Andrea Lorenzo Vitali, Federico Giovanni Ziglioli, Bruno Biffi, Tong Yan Tee 2014-08-12
8796826 Window clamp top plate for integrated circuit packaging Kim-Yong Goh, Wingshenq Wong 2014-08-05
8772943 Offset of contact opening for copper pillars in flip chip packages Kim-Yong Goh 2014-07-08
8592980 Carbon nanotube-modified low-K materials Shanzhong Wang, Valeriy Nosik, Tong Yan Tee 2013-11-26
8486824 Enhancing metal/low-K interconnect reliability using a protection layer Tong Yan Tee, Shanzhong Wang, Valeriy Nosik, Jijie Zhou, Sridhar Idapalapati +2 more 2013-07-16
8217518 Enhancing metal/low-K interconnect reliability using a protection layer Tong Yan Tee, Shanzhong Wang, Valeriy Nosik, Jijie Zhou, Sridhar Idapalapati +2 more 2012-07-10