Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8163645 | Method for providing a redistribution metal layer in an integrated circuit | Danielle A. Thomas, Antonio A. Do Bento Vieira, Anthony M. Chiu | 2012-04-24 |
| 7786582 | System for providing a redistribution metal layer in an integrated circuit | Danielle A. Thomas, Antonio A. Do Bento Vieira, Anthony M. Chiu | 2010-08-31 |
| 7595017 | Method for using a pre-formed film in a transfer molding process for an integrated circuit | Anthony M. Chiu | 2009-09-29 |
| 7456050 | System and method for controlling integrated circuit die height and planarity | Robert H. Bond, Tom Lao | 2008-11-25 |
| 7202110 | Embedded flat film molding | Anthony M. Chiu | 2007-04-10 |
| 7109574 | Integrated circuit package with exposed die surfaces and auxiliary attachment | Anthony M. Chiu | 2006-09-19 |
| 7096581 | Method for providing a redistribution metal layer in an integrated circuit | Danielle A. Thomas, Antonio Vieira, Jr., Anthony M. Chiu | 2006-08-29 |
| 7098065 | Integrated lid formed on MEMS device | Anthony M. Chiu | 2006-08-29 |
| 6951125 | System and method for aligning an integrated circuit die on an integrated circuit substrate | Anthony M. Chiu | 2005-10-04 |
| 6900508 | Embedded flat film molding | Anthony M. Chiu | 2005-05-31 |
| 6785137 | Method and system for removing heat from an active area of an integrated circuit device | — | 2004-08-31 |
| 6769174 | Leadframeless package structure and method | Anthony M. Chiu | 2004-08-03 |
| 6771500 | System and method for direct convective cooling of an exposed integrated circuit die surface | Anthony M. Chiu | 2004-08-03 |
| 6762470 | Fingerprint sensor having a portion of the fluorocarbon polymer physical interface layer amorphized | Fred Lane | 2004-07-13 |
| 6759326 | Method of making a semiconductor device having a planarized fluoropolymer passivating layer with selectively implanted charged particles | Fred Lane | 2004-07-06 |
| 6707093 | Selective ionic implantation of fluoropolymer film to modify the sensitivity of underlying sensing capacitors | Fred Lane, Richard P. Evans | 2004-03-16 |
| 6700190 | Integrated circuit device with exposed upper and lower die surfaces | Anthony M. Chiu | 2004-03-02 |
| 6693441 | Capacitive fingerprint sensor with protective coating containing a conductive suspension | Fred Lane, Giovanni Gozzini | 2004-02-17 |
| 6603192 | Scratch resistance improvement by filling metal gaps | Danielle A. Thomas | 2003-08-05 |
| 6600227 | System and method for providing mechanical planarization of a sequential build up substrate for an integrated circuit package | Anthony M. Chiu | 2003-07-29 |
| 6372543 | Wrap-around interconnect for fine pitch ball grid array | Anthony M. Chiu, Tom Lao, Michael J. Hundt | 2002-04-16 |
| 6121678 | Wrap-around interconnect for fine pitch ball grid array | Anthony M. Chiu, Tom Lao, Michael J. Hundt | 2000-09-19 |
| 5994774 | Surface mountable integrated circuit package with detachable module and interposer | Michael J. Hundt, Robert H. Bond | 1999-11-30 |
| 5724728 | Method of mounting an integrated circuit to a mounting surface | Robert H. Bond | 1998-03-10 |
| 5642265 | Ball grid array package with detachable module | Robert H. Bond | 1997-06-24 |