Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5610800 | Substrate mounting of circuit components with a low profile | Michael J. Hundt | 1997-03-11 |
| 5570273 | Surface mountable integrated circuit package with low-profile detachable module | Tom Lao, Krishnan Kelappan, Michael J. Hundt | 1996-10-29 |
| 5557504 | Surface mountable integrated circuit package with detachable module | Michael J. Hundt, Krishnan Kelappan | 1996-09-17 |
| 5451715 | Molded package integrated circuit with electrochemical cell | Michael J. Hundt, Krishnan Kelappan | 1995-09-19 |
| D359028 | Socketed integrated circuit package | Michael J. Hundt, Krishnan Kelappan | 1995-06-06 |
| D358804 | Detachable integrated circuit module | Michael J. Hundt, Krishnan Kelappan | 1995-05-30 |
| D358805 | Detachable integrated circuit module | Michael J. Hundt, Krishnan Kelappan | 1995-05-30 |
| D358806 | Socketed integrated circuit package | Michael J. Hundt, Krishnan Kelappan | 1995-05-30 |
| D354275 | Low-profile detachable integrated circuit module | Tom Lao, Krishnan Kelappan, Michael J. Hundt | 1995-01-10 |
| D354274 | Low-profile detachable integrated circuit module | Tom Lao, Krishnan Kelappan, Michael J. Hundt | 1995-01-10 |