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System and method for venting pressure from an integrated circuit package sealed with a lid |
Anthony M. Chiu |
2009-05-19 |
| 7456050 |
System and method for controlling integrated circuit die height and planarity |
Harry Michael Siegel, Robert H. Bond |
2008-11-25 |
| 7126210 |
System and method for venting pressure from an integrated circuit package sealed with a lid |
Anthony M. Chiu |
2006-10-24 |
| 6846186 |
BGA memory module with battery pack |
Krishnan Kelappan, Mike Hundt |
2005-01-25 |
| 6437984 |
Thermally enhanced chip scale package |
Anthony M. Chiu |
2002-08-20 |
| 6372543 |
Wrap-around interconnect for fine pitch ball grid array |
Anthony M. Chiu, Harry Michael Siegel, Michael J. Hundt |
2002-04-16 |
| 6121678 |
Wrap-around interconnect for fine pitch ball grid array |
Anthony M. Chiu, Harry Michael Siegel, Michael J. Hundt |
2000-09-19 |
| 5570273 |
Surface mountable integrated circuit package with low-profile detachable module |
Harry Michael Siegel, Krishnan Kelappan, Michael J. Hundt |
1996-10-29 |
| D354274 |
Low-profile detachable integrated circuit module |
Harry Michael Siegel, Krishnan Kelappan, Michael J. Hundt |
1995-01-10 |
| D354275 |
Low-profile detachable integrated circuit module |
Harry Michael Siegel, Krishnan Kelappan, Michael J. Hundt |
1995-01-10 |