Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12327679 | Process for making laminate substrate with sintered components | Deepukumar M. Nair, Jeffrey Dekosky | 2025-06-10 |
| 11929300 | Method for packaging an integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL) | Kevin J. Anderson, Andrew Arthur Ketterson, Deep C. Dumka, Christo Bojkov | 2024-03-12 |
| 11783998 | Process for making laminate substrate with sintered components | Deepukumar M. Nair, Jeffrey Dekosky | 2023-10-10 |
| 11626340 | Integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL) | Kevin J. Anderson, Andrew Arthur Ketterson, Deep C. Dumka, Christo Bojkov | 2023-04-11 |
| 11551995 | Substrate with embedded active thermoelectric cooler | Mark C. Woods, Kelly M. Lear, Deepukumar M. Nair, Bradford Nelson | 2023-01-10 |
| 10906274 | Laminate substrate with sintered components | Deepukumar M. Nair, Jeffrey Dekosky | 2021-02-02 |
| 10587029 | Multi-layer substrate with integrated resonator | Jeffrey Dekosky, Deepukumar M. Nair, Scott M. Knapp, Lawrence A. Carastro, Timothy G. Kraus | 2020-03-10 |
| 10390434 | Laminate-based package with internal overmold | Kevin J. Anderson, Walid M. Meliane | 2019-08-20 |
| 10217686 | Air-cavity package with enhanced package integration level and thermal performance | Walid M. Meliane, Kevin J. Anderson | 2019-02-26 |
| 10177064 | Air cavity package | Kevin J. Anderson, Anthony M. Chiu | 2019-01-08 |
| 10141245 | High-power acoustic device with improved performance | Ian Y. K. Yee, Jeffrey D. Galipeau, Jason Wu, Rodolfo E. Chang | 2018-11-27 |
| 10096536 | Graphene heat dissipating structure | Cody M. Washburn, Timothy N. Lambert, David R. Wheeler, Christopher T. Rodenbeck | 2018-10-09 |
| 9991181 | Air-cavity package with enhanced package integration level and thermal performance | Walid M. Meliane, Kevin J. Anderson | 2018-06-05 |
| 9974158 | Air-cavity package with two heat dissipation interfaces | Kevin J. Anderson, Walid M. Meliane | 2018-05-15 |
| 9799637 | Semiconductor package with lid having lid conductive structure | Brian P. Balut, Jonathan J. Fain, Kevin J. Anderson | 2017-10-24 |
| 9793237 | Hollow-cavity flip-chip package with reinforced interconnects and process for making the same | Kevin J. Anderson | 2017-10-17 |
| 9721867 | Graphene heat dissipating structure | Cody M. Washburn, Timothy N. Lambert, David R. Wheeler, Christopher T. Rodenbeck | 2017-08-01 |
| 9659898 | Apparatuses, systems, and methods for die attach coatings for semiconductor packages | Kevin J. Anderson, Walid M. Meliane, John Beall | 2017-05-23 |
| 9589864 | Substrate with embedded sintered heat spreader and process for making the same | — | 2017-03-07 |
| 9585240 | Advanced grounding scheme | Thomas R. Landon, Jr., Paul D. Bantz | 2017-02-28 |
| 9559034 | Package for high-power semiconductor devices | Deep C. Dumka | 2017-01-31 |
| 8946904 | Substrate vias for heat removal from semiconductor die | Ashish Alawani, Ray Parkhurst | 2015-02-03 |
| 8946894 | Package for high-power semiconductor devices | Deep C. Dumka | 2015-02-03 |
| 8921995 | Integrated circuit package including a three-dimensional fan-out/fan-in signal routing | Steven D. Cate | 2014-12-30 |
| 8908383 | Thermal via structures with surface features | Paul D. Bantz | 2014-12-09 |