Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11877505 | Fluorinated polymers with low dielectric loss for environmental protection in semiconductor devices | Christo Bojkov, Michael Roberg, Matthew Essar, Terry Hon | 2024-01-16 |
| 10390434 | Laminate-based package with internal overmold | Kevin J. Anderson, Tarak A. Railkar | 2019-08-20 |
| 10217686 | Air-cavity package with enhanced package integration level and thermal performance | Kevin J. Anderson, Tarak A. Railkar | 2019-02-26 |
| 10015882 | Modular semiconductor package | Dylan Murdock, Binh K. Le, Michael Arnold | 2018-07-03 |
| 9991181 | Air-cavity package with enhanced package integration level and thermal performance | Kevin J. Anderson, Tarak A. Railkar | 2018-06-05 |
| 9974158 | Air-cavity package with two heat dissipation interfaces | Tarak A. Railkar, Kevin J. Anderson | 2018-05-15 |
| 9659898 | Apparatuses, systems, and methods for die attach coatings for semiconductor packages | Tarak A. Railkar, Kevin J. Anderson, John Beall | 2017-05-23 |