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Wafer-level-packaged BAW devices with surface mount connection structures |
Matthew Wasilik, Buu Q. Diep, Bang Nguyen, Ebrahim Andideh, Robert Kraft |
2019-07-30 |
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High-power acoustic device with improved performance |
Tarak A. Railkar, Jeffrey D. Galipeau, Jason Wu, Rodolfo E. Chang |
2018-11-27 |
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Acoustic wave device |
Suzanne Combe, Kurt G. Steiner, Alan S. Chen, Charles E. Carpenter, Jean Briot +1 more |
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Gradually-actuating micromechanical device |
— |
2004-03-16 |
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Titanium-tungsten etching solutions |
— |
1993-05-18 |
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Selective electroless plating process for metal conductors |
Charles W. C. Lin |
1992-12-01 |
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Fabrication of metal pillars in an electronic component using polishing |
John Curry |
1992-08-11 |
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Electroplating method |
James Wehrly |
1992-08-04 |
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Detecting completion of electroless via fill |
Charles W. C. Lin, Randy L. German, David M. Sigmond |
1992-05-26 |
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Method for patterning electroless plated metal on a polymer substrate |
Tom J. Hirsch, Charles W. C. Lin |
1992-01-28 |
| 5078852 |
Plating rack |
James Wehrly |
1992-01-07 |
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Spray pyrolysis process for preparing superconductive films |
Hsyh-Min Hsu |
1991-06-04 |
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Copper etching solution and method |
Charles W. C. Lin |
1990-08-28 |
| 4920639 |
Method of making a multilevel electrical airbridge interconnect |
— |
1990-05-01 |