Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5830533 | Selective patterning of metallization on a dielectric substrate | Charles W. C. Lin | 1998-11-03 |
| 5508228 | Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same | Ernest R. Nolan, Diana C. Duane, Todd H. Herder, Thomas Alan Bishop, Kimcuc T. Tran +5 more | 1996-04-16 |
| 5116463 | Detecting completion of electroless via fill | Charles W. C. Lin, Ian Y. K. Yee, David M. Sigmond | 1992-05-26 |