Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE50523 | Radio access network service mediated enhanced session records for artificial intelligence or machine learning | Wing F. Lo | 2025-08-05 |
| 11496811 | Systems and methods for improving communications network performance using video session data | Wing F. Lo, Karsten Gaenger | 2022-11-08 |
| 11265786 | Radio access network service mediated enhanced session records for artificial intelligence or machine learning | Wing F. Lo | 2022-03-01 |
| 10966108 | Optimizing radio cell quality for capacity and quality of service using machine learning techniques | Ralf Kreher | 2021-03-30 |
| 10382883 | Automatic calibration of geolocation analytic systems and operator network equipment parameters | Karsten Gaenger, Wing F. Lo | 2019-08-13 |
| 10326640 | Knowledge base radio and core network prescriptive root cause analysis | — | 2019-06-18 |
| 9485679 | Apparatus and method for analyzing the quality of a cell in a mobile device network | Ralf Kreher, Martin Polak, Martin Winau | 2016-11-01 |
| 9414250 | Determining quality of experience confidence level for mobile subscribers | — | 2016-08-09 |
| 8849800 | System and method of forwarding end user correlated user and control plane or network states to OSS system | Lisan Lin | 2014-09-30 |
| 8559967 | System and method for managing subscriber bandwidth based on cell congestion analysis | Fang Tang, Shankar Selvavinayagam | 2013-10-15 |
| 8004969 | Cell level congestion policy management | Rangaprasad Govindarajan, Jogen Pathak, Vyankatesh Shanbhag | 2011-08-23 |
| 6950007 | Method and device for monitoring enablement of an electrical apparatus connected to a power grid | Fabrice Martin, Yves Dherbecourt | 2005-09-27 |
| 5508228 | Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same | Ernest R. Nolan, Diana C. Duane, Todd H. Herder, Thomas Alan Bishop, Kimcuc T. Tran +5 more | 1996-04-16 |
| 5445308 | Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal | Richard D. Nelson, Thomas P. Dolbear | 1995-08-29 |
| 5328087 | Thermally and electrically conductive adhesive material and method of bonding with same | Richard D. Nelson, Thomas P. Dolbear | 1994-07-12 |