| 11488922 |
Back side metallization |
Daniel Cavasin, Sanjay Dandia |
2022-11-01 |
| 10957669 |
Back side metallization |
Daniel Cavasin, Sanjay Dandia |
2021-03-23 |
| 10431562 |
Back side metallization |
Daniel Cavasin, Sanjay Dandia |
2019-10-01 |
| 10242962 |
Back side metallization |
Daniel Cavasin, Sanjay Dandia |
2019-03-26 |
| 8198723 |
Low inductance power distribution system for an integrated circuit chip |
Dennis J. Herrell |
2012-06-12 |
| 6828666 |
Low inductance power distribution system for an integrated circuit chip |
Dennis J. Herrell |
2004-12-07 |
| 6477047 |
Temperature sensor mounting for accurate measurement and durability |
Doug Markwardt, Lewis M. Eyman |
2002-11-05 |
| 6462956 |
Arrangement for reducing non-uniformity in current flow through various power pins within a printed wiring board connector for a removable module |
Dennis J. Herrell |
2002-10-08 |
| 5963023 |
Power surge management for high performance integrated circuit |
Dennis J. Herrell |
1999-10-05 |
| 5926371 |
Heat transfer apparatus which accommodates elevational disparity across an upper surface of a surface-mounted semiconductor device |
— |
1999-07-20 |
| 5907474 |
Low-profile heat transfer apparatus for a surface-mounted semiconductor device employing a ball grid array (BGA) device package |
— |
1999-05-25 |
| 5445308 |
Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal |
Richard D. Nelson, Robert W. Froehlich |
1995-08-29 |
| 5344795 |
Method for encapsulating an integrated circuit using a removable heatsink support block |
Seyed H. Hashemi, Michael A. Olla, Richard D. Nelson |
1994-09-06 |
| 5328087 |
Thermally and electrically conductive adhesive material and method of bonding with same |
Richard D. Nelson, Robert W. Froehlich |
1994-07-12 |
| 5309321 |
Thermally conductive screen mesh for encapsulated integrated circuit packages |
Michael A. Olla, Seyed H. Hashemi |
1994-05-03 |
| 5265321 |
Integrated circuit structure with heat exchanger elements secured thereto and method of making |
Richard D. Nelson, Michael A. Olla, Seyed H. Hashemi |
1993-11-30 |
| 5170930 |
Liquid metal paste for thermal and electrical connections |
Colin A. MacKay, Richard D. Nelson |
1992-12-15 |
| 5056706 |
Liquid metal paste for thermal and electrical connections |
Colin A. MacKay, Richard D. Nelson |
1991-10-15 |
| 4993482 |
Coiled spring heat transfer element |
Richard D. Nelson, David A. Gibson, Omkarnath R. Gupta |
1991-02-19 |