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USPTO Patent Rankings Data through Dec 31, 2025
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Thomas P. Dolbear — 19 Patents

AMD: 11 patents #1,183 of 9,280Top 15%
MTMicroelectronic & Computer Technology: 7 patents #11 of 112Top 10%
Austin, TX: #1,717 of 18,064 inventorsTop 10%
Texas: #7,372 of 125,132 inventorsTop 6%
Overall (All Time): #229,345 of 4,157,543Top 6%
19 Patents All Time
Thomas P. Dolbear has been granted 19 US patents while listed as an inventor at AMD. The first was granted in 1991 and the most recent in November 2022. Thomas P. Dolbear ranks #229,345 of 4,157,543 US inventors in our database (top 5.5%). Patent records list Thomas P. Dolbear in Austin, TX, US.

Issued Patents All Time

Showing 1–19 of 19 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
11488922 Back side metallization Daniel Cavasin, Sanjay Dandia 2022-11-01 $136,944,000
10957669 Back side metallization Daniel Cavasin, Sanjay Dandia 2021-03-23 $85,424,000
10431562 Back side metallization Daniel Cavasin, Sanjay Dandia 2019-10-01 $27,042,000
10242962 Back side metallization Daniel Cavasin, Sanjay Dandia 2019-03-26 $28,977,000
8198723 Low inductance power distribution system for an integrated circuit chip Dennis J. Herrell 2012-06-12 $4,410,000
6828666 Low inductance power distribution system for an integrated circuit chip Dennis J. Herrell 2004-12-07 $8,137,000
6477047 Temperature sensor mounting for accurate measurement and durability Doug Markwardt, Lewis M. Eyman 2002-11-05 $1,578,000
6462956 Arrangement for reducing non-uniformity in current flow through various power pins within a printed wiring board connector for a removable module Dennis J. Herrell 2002-10-08 $890,000
5963023 Power surge management for high performance integrated circuit Dennis J. Herrell 1999-10-05 $1,787,000
5926371 Heat transfer apparatus which accommodates elevational disparity across an upper surface of a surface-mounted semiconductor device 1999-07-20 $1,833,000
5907474 Low-profile heat transfer apparatus for a surface-mounted semiconductor device employing a ball grid array (BGA) device package 1999-05-25 $7,746,000
5445308 Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal Richard D. Nelson, Robert W. Froehlich 1995-08-29
5344795 Method for encapsulating an integrated circuit using a removable heatsink support block Seyed H. Hashemi, Michael A. Olla, Richard D. Nelson 1994-09-06
5328087 Thermally and electrically conductive adhesive material and method of bonding with same Richard D. Nelson, Robert W. Froehlich 1994-07-12
5309321 Thermally conductive screen mesh for encapsulated integrated circuit packages Michael A. Olla, Seyed H. Hashemi 1994-05-03
5265321 Integrated circuit structure with heat exchanger elements secured thereto and method of making Richard D. Nelson, Michael A. Olla, Seyed H. Hashemi 1993-11-30
5170930 Liquid metal paste for thermal and electrical connections Colin A. MacKay, Richard D. Nelson 1992-12-15
5056706 Liquid metal paste for thermal and electrical connections Colin A. MacKay, Richard D. Nelson 1991-10-15
4993482 Coiled spring heat transfer element Richard D. Nelson, David A. Gibson, Omkarnath R. Gupta 1991-02-19