Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488922 | Back side metallization | Daniel Cavasin, Sanjay Dandia | 2022-11-01 |
| 10957669 | Back side metallization | Daniel Cavasin, Sanjay Dandia | 2021-03-23 |
| 10431562 | Back side metallization | Daniel Cavasin, Sanjay Dandia | 2019-10-01 |
| 10242962 | Back side metallization | Daniel Cavasin, Sanjay Dandia | 2019-03-26 |
| 8198723 | Low inductance power distribution system for an integrated circuit chip | Dennis J. Herrell | 2012-06-12 |
| 6828666 | Low inductance power distribution system for an integrated circuit chip | Dennis J. Herrell | 2004-12-07 |
| 6477047 | Temperature sensor mounting for accurate measurement and durability | Doug Markwardt, Lewis M. Eyman | 2002-11-05 |
| 6462956 | Arrangement for reducing non-uniformity in current flow through various power pins within a printed wiring board connector for a removable module | Dennis J. Herrell | 2002-10-08 |
| 5963023 | Power surge management for high performance integrated circuit | Dennis J. Herrell | 1999-10-05 |
| 5926371 | Heat transfer apparatus which accommodates elevational disparity across an upper surface of a surface-mounted semiconductor device | — | 1999-07-20 |
| 5907474 | Low-profile heat transfer apparatus for a surface-mounted semiconductor device employing a ball grid array (BGA) device package | — | 1999-05-25 |
| 5445308 | Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal | Richard D. Nelson, Robert W. Froehlich | 1995-08-29 |
| 5344795 | Method for encapsulating an integrated circuit using a removable heatsink support block | Seyed H. Hashemi, Michael A. Olla, Richard D. Nelson | 1994-09-06 |
| 5328087 | Thermally and electrically conductive adhesive material and method of bonding with same | Richard D. Nelson, Robert W. Froehlich | 1994-07-12 |
| 5309321 | Thermally conductive screen mesh for encapsulated integrated circuit packages | Michael A. Olla, Seyed H. Hashemi | 1994-05-03 |
| 5265321 | Integrated circuit structure with heat exchanger elements secured thereto and method of making | Richard D. Nelson, Michael A. Olla, Seyed H. Hashemi | 1993-11-30 |
| 5170930 | Liquid metal paste for thermal and electrical connections | Colin A. MacKay, Richard D. Nelson | 1992-12-15 |
| 5056706 | Liquid metal paste for thermal and electrical connections | Colin A. MacKay, Richard D. Nelson | 1991-10-15 |
| 4993482 | Coiled spring heat transfer element | Richard D. Nelson, David A. Gibson, Omkarnath R. Gupta | 1991-02-19 |