| 6848500 |
Cooling system for pulsed power electronics |
Abdolreza Langari |
2005-02-01 |
| 6586847 |
Method and structure for temperature stabilization in semiconductor devices |
Abdolreza Langari, Surasit Chungpaiboonpatana |
2003-07-01 |
| 6359343 |
Temperature stabilization in flip chip technology |
Abdolreza Langari |
2002-03-19 |
| 6261871 |
Method and structure for temperature stabilization in flip chip technology |
Abdolreza Langari |
2001-07-17 |
| 5403784 |
Process for manufacturing a stacked multiple leadframe semiconductor package using an alignment template |
Michael A. Olla, John Parker |
1995-04-04 |
| 5383269 |
Method of making three dimensional integrated circuit interconnect module |
Claude Rathmell, Carroll S. Vance, David Barnes |
1995-01-24 |
| 5344795 |
Method for encapsulating an integrated circuit using a removable heatsink support block |
Michael A. Olla, Thomas P. Dolbear, Richard D. Nelson |
1994-09-06 |
| 5309321 |
Thermally conductive screen mesh for encapsulated integrated circuit packages |
Michael A. Olla, Thomas P. Dolbear |
1994-05-03 |
| 5265321 |
Integrated circuit structure with heat exchanger elements secured thereto and method of making |
Richard D. Nelson, Michael A. Olla, Thomas P. Dolbear |
1993-11-30 |
| 5049979 |
Combined flat capacitor and tab integrated circuit chip and method |
David H. Carey |
1991-09-17 |