| 8021058 |
Fabrication of optical devices and assemblies |
Kenneth C. Noddings, Daniel Marshall Andrews, Thomas Alan Bishop |
2011-09-20 |
| 7413688 |
Fabrication of optical devices and assemblies |
Kenneth C. Noddings, Daniel Marshall Andrews, Thomas Alan Bishop |
2008-08-19 |
| 5574814 |
Parallel optical transceiver link |
Kenneth C. Noddings, Robert C. Gardner, Thomas J. Hirsch, Charles L. Spooner, Jason J. Yu |
1996-11-12 |
| 5503948 |
Thin cell electrochemical battery system; and method of interconnecting multiple thin cells |
Colin A. MacKay |
1996-04-02 |
| 5403784 |
Process for manufacturing a stacked multiple leadframe semiconductor package using an alignment template |
Seyed H. Hashemi, John Parker |
1995-04-04 |
| 5344795 |
Method for encapsulating an integrated circuit using a removable heatsink support block |
Seyed H. Hashemi, Thomas P. Dolbear, Richard D. Nelson |
1994-09-06 |
| 5309321 |
Thermally conductive screen mesh for encapsulated integrated circuit packages |
Thomas P. Dolbear, Seyed H. Hashemi |
1994-05-03 |
| 5265321 |
Integrated circuit structure with heat exchanger elements secured thereto and method of making |
Richard D. Nelson, Seyed H. Hashemi, Thomas P. Dolbear |
1993-11-30 |
| 5182851 |
Method for holding a strip of conductive lead frames |
Robert H. Bond, Barry L. Morrison, Linn C. Garrison |
1993-02-02 |
| 5171290 |
Testing socket for tab tape |
Howard A. Moore, Daniel Marshall Andrews |
1992-12-15 |
| 5111935 |
Universal leadframe carrier |
Robert H. Bond, Barry L. Morrison, Linn C. Garrison |
1992-05-12 |
| 5065504 |
Method of forming flexible metal leads on integrated circuits |
— |
1991-11-19 |
| 5057903 |
Thermal heat sink encapsulated integrated circuit |
— |
1991-10-15 |
| 4915565 |
Manipulation and handling of integrated circuit dice |
Robert H. Bond, Steven Swendrowski, Barry L. Morrison |
1990-04-10 |
| 4815595 |
Uniform leadframe carrier |
Robert H. Bond, Barry L. Morrison, Linn C. Garrison |
1989-03-28 |
| 4759675 |
Chip selection in automatic assembly of integrated circuit |
Robert H. Bond, Steven Swendrowski, Barry L. Morrison, Ricky Parkinson, Linn C. Garrison +1 more |
1988-07-26 |
| 4743956 |
Offset bending of curvaceously planar radiating leadframe leads in semiconductor chip packaging |
Linn C. Garrison, Robert H. Bond, Harold L. Trammell |
1988-05-10 |
| 4722060 |
Integrated-circuit leadframe adapted for a simultaneous bonding operation |
Daniel J. Quinn, Robert H. Bond, Wayne A. Mulholland, Steven Swendrowski, Jerry S. Cupples +3 more |
1988-01-26 |
| D288922 |
Zero power random access memory package |
— |
1987-03-24 |
| 4627151 |
Automatic assembly of integrated circuits |
Wayne A. Mulholland, Daniel J. Quinn, Robert H. Bond |
1986-12-09 |
| 4627787 |
Chip selection in automatic assembly of integrated circuit |
Robert H. Bond, Steven Swendrowski, Barry L. Morrison, Ricky Parkinson, Linn C. Garrison +1 more |
1986-12-09 |
| 4626167 |
Manipulation and handling of integrated circuit dice |
Robert H. Bond, Steven Swendrowski, Barry L. Morrison |
1986-12-02 |