Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4722060 | Integrated-circuit leadframe adapted for a simultaneous bonding operation | Daniel J. Quinn, Robert H. Bond, Wayne A. Mulholland, Steven Swendrowski, Michael A. Olla +3 more | 1988-01-26 |