| 5438166 |
Customizable circuitry |
Barry H. Whalen |
1995-08-01 |
| 5379191 |
Compact adapter package providing peripheral to area translation for an integrated circuit chip |
Barry H. Whalen |
1995-01-03 |
| 5289346 |
Peripheral to area adapter with protective bumper for an integrated circuit chip |
Barry H. Whalen |
1994-02-22 |
| 5284548 |
Process for producing electrical circuits with precision surface features |
David Burger |
1994-02-08 |
| 5272600 |
Electrical interconnect device with interwoven power and ground lines and capacitive vias |
— |
1993-12-21 |
| 5240671 |
Method of forming recessed patterns in insulating substrates |
— |
1993-08-31 |
| 5219787 |
Trenching techniques for forming channels, vias and components in substrates |
Douglass A. Pietila, David M. Sigmond |
1993-06-15 |
| 5216803 |
Method and apparatus for removing bonded connections |
Ernest R. Nolan, Thomas Alan Bishop |
1993-06-08 |
| 5173442 |
Methods of forming channels and vias in insulating layers |
— |
1992-12-22 |
| 5165166 |
Method of making a customizable circuitry |
— |
1992-11-24 |
| 5132878 |
Customizable circuitry |
— |
1992-07-21 |
| 5101553 |
Method of making a metal-on-elastomer pressure contact connector |
David M. Sigmond |
1992-04-07 |
| 5091339 |
Trenching techniques for forming vias and channels in multilayer electrical interconnects |
— |
1992-02-25 |
| 5049979 |
Combined flat capacitor and tab integrated circuit chip and method |
Seyed H. Hashemi |
1991-09-17 |
| 5039628 |
Flip substrate for chip mount |
— |
1991-08-13 |
| 4926241 |
Flip substrate for chip mount |
— |
1990-05-15 |
| 4829242 |
Multigigahertz probe |
Roger B. Jennings |
1989-05-09 |
