Sanjay Dandia — 23 Patents at AMD

Sanjay Dandia has been granted 23 US patents while listed as an inventor at AMD. The first was granted in 1997 and the most recent in November 2025. Sanjay Dandia ranks #178,160 of 4,157,543 US inventors in our database (top 4.3%). Patent records list Sanjay Dandia in Sunnyvale, CA, US.

Patents per Year

Issued Patents All Time

Showing 1–23 of 23 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12482738	Systems and methods for dimensioning a land grid array pad	Changsheng Liang	2025-11-25
11488922	Back side metallization	Thomas P. Dolbear, Daniel Cavasin	2022-11-01	$136,944,000
10957669	Back side metallization	Thomas P. Dolbear, Daniel Cavasin	2021-03-23	$85,424,000
10636736	Land pad design for high speed terminals	Gerald R. Talbot, Mahesh S. Hardikar	2020-04-28	$42,649,000
10431562	Back side metallization	Thomas P. Dolbear, Daniel Cavasin	2019-10-01	$27,042,000
10389053	Circuit board socket with rail frame	Stephen F. Heng, Mahesh S. Hardikar	2019-08-20	$22,608,000
10242962	Back side metallization	Thomas P. Dolbear, Daniel Cavasin	2019-03-26	$28,977,000
9466900	Circuit board socket with rail frame	Stephen F. Heng, Mahesh S. Hardikar	2016-10-11	$4,519,000
8216887	Semiconductor chip package with stiffener frame and configured lid	Stephen F. Heng, Chia-Ken Leong	2012-07-10	$3,144,000
D661667	Socket assembly	Stephen F. Heng, Mahesh S. Hardikar, Ali Hassanzadeh	2012-06-12
D658607	Circuit package lid	Stephen F. Heng, Nikon Banouvong, Chia-Ken Leong	2012-05-01
D648688	Socket housing	Stephen F. Heng, Ali Hassanzadeh, Mahesh S. Hardikar	2011-11-15
D645426	Socket assembly	Stephen F. Heng, Mahesh S. Hardikar, Ali Hassanzadeh	2011-09-20
D641720	Circuit package lid	Stephen F. Heng, Nikon Banouvong, Chia-Ken Leong	2011-07-19
D633877	Socket frame	Stephen F. Heng, Mahesh S. Hardikar, Ali Hassanzadeh	2011-03-08
D633880	Socket housing	Stephen F. Heng, Ali Hassanzadeh, Mahesh S. Hardikar	2011-03-08
6246121	High performance flip-chip semiconductor device	Jayarama N. Shenoy	2001-06-12
6198635	Interconnect layout pattern for integrated circuit packages and the like	Jayarama N. Shenoy	2001-03-06
5814892	Semiconductor die with staggered bond pads	Michael J. Steidl	1998-09-29	$3,211,000
5796171	Progressive staggered bonding pads	Aydin Koc, Michael J. Steidl	1998-08-18	$3,650,000
5753070	Vacuum chuck tool for a making a plastic-package ball-grid array integrated circuit, and combination	—	1998-05-19	$12,719,000
5749999	Method for making a surface-mount technology plastic-package ball-grid array integrated circuit	—	1998-05-12	$20,494,000
5691568	Wire bondable package design with maxium electrical performance and minimum number of layers	Tai-Yu Chou	1997-11-25	$9,872,000

Sanjay Dandia — 23 Patents

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