Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488922 | Back side metallization | Thomas P. Dolbear, Daniel Cavasin | 2022-11-01 |
| 10957669 | Back side metallization | Thomas P. Dolbear, Daniel Cavasin | 2021-03-23 |
| 10636736 | Land pad design for high speed terminals | Gerald R. Talbot, Mahesh S. Hardikar | 2020-04-28 |
| 10431562 | Back side metallization | Thomas P. Dolbear, Daniel Cavasin | 2019-10-01 |
| 10389053 | Circuit board socket with rail frame | Stephen F. Heng, Mahesh S. Hardikar | 2019-08-20 |
| 10242962 | Back side metallization | Thomas P. Dolbear, Daniel Cavasin | 2019-03-26 |
| 9466900 | Circuit board socket with rail frame | Stephen F. Heng, Mahesh S. Hardikar | 2016-10-11 |
| 8216887 | Semiconductor chip package with stiffener frame and configured lid | Stephen F. Heng, Chia-Ken Leong | 2012-07-10 |
| D661667 | Socket assembly | Stephen F. Heng, Mahesh S. Hardikar, Ali Hassanzadeh | 2012-06-12 |
| D658607 | Circuit package lid | Stephen F. Heng, Nikon Banouvong, Chia-Ken Leong | 2012-05-01 |
| D648688 | Socket housing | Stephen F. Heng, Ali Hassanzadeh, Mahesh S. Hardikar | 2011-11-15 |
| D645426 | Socket assembly | Stephen F. Heng, Mahesh S. Hardikar, Ali Hassanzadeh | 2011-09-20 |
| D641720 | Circuit package lid | Stephen F. Heng, Nikon Banouvong, Chia-Ken Leong | 2011-07-19 |
| D633877 | Socket frame | Stephen F. Heng, Mahesh S. Hardikar, Ali Hassanzadeh | 2011-03-08 |
| D633880 | Socket housing | Stephen F. Heng, Ali Hassanzadeh, Mahesh S. Hardikar | 2011-03-08 |
| 6246121 | High performance flip-chip semiconductor device | Jayarama N. Shenoy | 2001-06-12 |
| 6198635 | Interconnect layout pattern for integrated circuit packages and the like | Jayarama N. Shenoy | 2001-03-06 |
| 5814892 | Semiconductor die with staggered bond pads | Michael J. Steidl | 1998-09-29 |
| 5796171 | Progressive staggered bonding pads | Aydin Koc, Michael J. Steidl | 1998-08-18 |
| 5753070 | Vacuum chuck tool for a making a plastic-package ball-grid array integrated circuit, and combination | — | 1998-05-19 |
| 5749999 | Method for making a surface-mount technology plastic-package ball-grid array integrated circuit | — | 1998-05-12 |
| 5691568 | Wire bondable package design with maxium electrical performance and minimum number of layers | Tai-Yu Chou | 1997-11-25 |