| 11488922 |
Back side metallization |
Thomas P. Dolbear, Daniel Cavasin |
2022-11-01 |
| 10957669 |
Back side metallization |
Thomas P. Dolbear, Daniel Cavasin |
2021-03-23 |
| 10636736 |
Land pad design for high speed terminals |
Gerald R. Talbot, Mahesh S. Hardikar |
2020-04-28 |
| 10431562 |
Back side metallization |
Thomas P. Dolbear, Daniel Cavasin |
2019-10-01 |
| 10389053 |
Circuit board socket with rail frame |
Stephen F. Heng, Mahesh S. Hardikar |
2019-08-20 |
| 10242962 |
Back side metallization |
Thomas P. Dolbear, Daniel Cavasin |
2019-03-26 |
| 9466900 |
Circuit board socket with rail frame |
Stephen F. Heng, Mahesh S. Hardikar |
2016-10-11 |
| 8216887 |
Semiconductor chip package with stiffener frame and configured lid |
Stephen F. Heng, Chia-Ken Leong |
2012-07-10 |
| D661667 |
Socket assembly |
Stephen F. Heng, Mahesh S. Hardikar, Ali Hassanzadeh |
2012-06-12 |
| D658607 |
Circuit package lid |
Stephen F. Heng, Nikon Banouvong, Chia-Ken Leong |
2012-05-01 |
| D648688 |
Socket housing |
Stephen F. Heng, Ali Hassanzadeh, Mahesh S. Hardikar |
2011-11-15 |
| D645426 |
Socket assembly |
Stephen F. Heng, Mahesh S. Hardikar, Ali Hassanzadeh |
2011-09-20 |
| D641720 |
Circuit package lid |
Stephen F. Heng, Nikon Banouvong, Chia-Ken Leong |
2011-07-19 |
| D633877 |
Socket frame |
Stephen F. Heng, Mahesh S. Hardikar, Ali Hassanzadeh |
2011-03-08 |
| D633880 |
Socket housing |
Stephen F. Heng, Ali Hassanzadeh, Mahesh S. Hardikar |
2011-03-08 |
| 6246121 |
High performance flip-chip semiconductor device |
Jayarama N. Shenoy |
2001-06-12 |
| 6198635 |
Interconnect layout pattern for integrated circuit packages and the like |
Jayarama N. Shenoy |
2001-03-06 |
| 5814892 |
Semiconductor die with staggered bond pads |
Michael J. Steidl |
1998-09-29 |
| 5796171 |
Progressive staggered bonding pads |
Aydin Koc, Michael J. Steidl |
1998-08-18 |
| 5753070 |
Vacuum chuck tool for a making a plastic-package ball-grid array integrated circuit, and combination |
— |
1998-05-19 |
| 5749999 |
Method for making a surface-mount technology plastic-package ball-grid array integrated circuit |
— |
1998-05-12 |
| 5691568 |
Wire bondable package design with maxium electrical performance and minimum number of layers |
Tai-Yu Chou |
1997-11-25 |
