Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D658607 | Circuit package lid | Stephen F. Heng, Sanjay Dandia, Chia-Ken Leong | 2012-05-01 |
| D641720 | Circuit package lid | Stephen F. Heng, Sanjay Dandia, Chia-Ken Leong | 2011-07-19 |
| 6407462 | Irregular grid bond pad layout arrangement for a flip chip package | Farshad Ghahghahi | 2002-06-18 |