Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510721 | Molded chip combination | Milind S. Bhagavat, Lei Fu, Ivor G. Barber, Rahul Agarwal | 2019-12-17 |
| 8405187 | Chip package with channel stiffener frame | Eric Tosaya, Jun Zhai, Tom Ley | 2013-03-26 |
| 8216887 | Semiconductor chip package with stiffener frame and configured lid | Stephen F. Heng, Sanjay Dandia | 2012-07-10 |
| D658607 | Circuit package lid | Stephen F. Heng, Sanjay Dandia, Nikon Banouvong | 2012-05-01 |
| 8008133 | Chip package with channel stiffener frame | Eric Tosaya, Jun Zhai, Tom Ley | 2011-08-30 |
| D641720 | Circuit package lid | Stephen F. Heng, Sanjay Dandia, Nikon Banouvong | 2011-07-19 |