Eric Tosaya — 18 Patents at AMD

Eric Tosaya has been granted 18 US patents while listed as an inventor at AMD. The first was granted in 1988 and the most recent in June 2018. Eric Tosaya ranks #245,716 of 4,157,543 US inventors in our database (top 5.9%). Patent records list Eric Tosaya in Fremont, CA, US.

Issued Patents All Time

Showing 1–18 of 18 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
10008652	Light emitting diode device with reconstituted LED components on substrate	Liang Wang	2018-06-26
9620436	Light emitting diode device with reconstituted LED components on substrate	Liang Wang	2017-04-11
9524883	Holding of interposers and other microelectronic workpieces in position during assembly and other processing	Charles G. Woychik, Rajesh Katkar	2016-12-20
9496154	Use of underfill tape in microelectronic components, and microelectronic components with cavities coupled to through-substrate vias	Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh	2016-11-15
8405187	Chip package with channel stiffener frame	Jun Zhai, Chia-Ken Leong, Tom Ley	2013-03-26	$2,711,000
8008133	Chip package with channel stiffener frame	Jun Zhai, Chia-Ken Leong, Tom Ley	2011-08-30	$4,140,000
7243327	Method for automatically routing connections between top side conductors and bottom side conductors of an integrated circuit package	Alex Tain	2007-07-10	$100,671,000
7055122	Method for automatically connecting top side conductors with bottom side conductors of an integrated circuit package	Alex Tain	2006-05-30	$42,709,000
6976236	Method for automatically routing connections between top side conductors and bottom side conductors of an integrated circuit package	Alex Tain	2005-12-13
6538320	Heat spreader having holes for rivet-like adhesive connections	Edward S. Alcid	2003-03-25	$2,887,000
6512675	Heat sink grounded to a grounded package lid	Thomas S. Tarter, Tom Ley, Shrikar Bhagath, Nhon T. Do	2003-01-28	$2,528,000
6508845	Method and apparatus for precoining BGA type packages prior to electrical characterization	—	2003-01-21	$2,484,000
6483169	Extruded heat spreader	Edward S. Alcid	2002-11-19	$1,532,000
6399474	Method and apparatus for precoining BGA type packages prior to electrical characterization	—	2002-06-04	$2,015,000
5414222	Multilayer IC semiconductor package	Bidyut Sen	1995-05-09	$12,786,000
5304743	Multilayer IC semiconductor package	Bidyut Sen	1994-04-19	$10,855,000
4810671	Process for bonding die to substrate using a gold/silicon seed	Bidyut K. Bhattacharyya	1989-03-07	$21,531,000
4771018	Process of attaching a die to a substrate using gold/silicon seed	Bidyut K. Bhattacharyya	1988-09-13	$55,444,000

Eric Tosaya — 18 Patents

Issued Patents All Time

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