Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10008652 | Light emitting diode device with reconstituted LED components on substrate | Liang Wang | 2018-06-26 |
| 9620436 | Light emitting diode device with reconstituted LED components on substrate | Liang Wang | 2017-04-11 |
| 9524883 | Holding of interposers and other microelectronic workpieces in position during assembly and other processing | Charles G. Woychik, Rajesh Katkar | 2016-12-20 |
| 9496154 | Use of underfill tape in microelectronic components, and microelectronic components with cavities coupled to through-substrate vias | Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh | 2016-11-15 |
| 8405187 | Chip package with channel stiffener frame | Jun Zhai, Chia-Ken Leong, Tom Ley | 2013-03-26 |
| 8008133 | Chip package with channel stiffener frame | Jun Zhai, Chia-Ken Leong, Tom Ley | 2011-08-30 |
| 7243327 | Method for automatically routing connections between top side conductors and bottom side conductors of an integrated circuit package | Alex Tain | 2007-07-10 |
| 7055122 | Method for automatically connecting top side conductors with bottom side conductors of an integrated circuit package | Alex Tain | 2006-05-30 |
| 6976236 | Method for automatically routing connections between top side conductors and bottom side conductors of an integrated circuit package | Alex Tain | 2005-12-13 |
| 6538320 | Heat spreader having holes for rivet-like adhesive connections | Edward S. Alcid | 2003-03-25 |
| 6512675 | Heat sink grounded to a grounded package lid | Thomas S. Tarter, Tom Ley, Shrikar Bhagath, Nhon T. Do | 2003-01-28 |
| 6508845 | Method and apparatus for precoining BGA type packages prior to electrical characterization | — | 2003-01-21 |
| 6483169 | Extruded heat spreader | Edward S. Alcid | 2002-11-19 |
| 6399474 | Method and apparatus for precoining BGA type packages prior to electrical characterization | — | 2002-06-04 |
| 5414222 | Multilayer IC semiconductor package | Bidyut Sen | 1995-05-09 |
| 5304743 | Multilayer IC semiconductor package | Bidyut Sen | 1994-04-19 |
| 4810671 | Process for bonding die to substrate using a gold/silicon seed | Bidyut K. Bhattacharyya | 1989-03-07 |
| 4771018 | Process of attaching a die to a substrate using gold/silicon seed | Bidyut K. Bhattacharyya | 1988-09-13 |