| 10008652 |
Light emitting diode device with reconstituted LED components on substrate |
Liang Wang |
2018-06-26 |
| 9620436 |
Light emitting diode device with reconstituted LED components on substrate |
Liang Wang |
2017-04-11 |
| 9524883 |
Holding of interposers and other microelectronic workpieces in position during assembly and other processing |
Charles G. Woychik, Rajesh Katkar |
2016-12-20 |
| 9496154 |
Use of underfill tape in microelectronic components, and microelectronic components with cavities coupled to through-substrate vias |
Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh |
2016-11-15 |
| 8405187 |
Chip package with channel stiffener frame |
Jun Zhai, Chia-Ken Leong, Tom Ley |
2013-03-26 |
| 8008133 |
Chip package with channel stiffener frame |
Jun Zhai, Chia-Ken Leong, Tom Ley |
2011-08-30 |
| 7243327 |
Method for automatically routing connections between top side conductors and bottom side conductors of an integrated circuit package |
Alex Tain |
2007-07-10 |
| 7055122 |
Method for automatically connecting top side conductors with bottom side conductors of an integrated circuit package |
Alex Tain |
2006-05-30 |
| 6976236 |
Method for automatically routing connections between top side conductors and bottom side conductors of an integrated circuit package |
Alex Tain |
2005-12-13 |
| 6538320 |
Heat spreader having holes for rivet-like adhesive connections |
Edward S. Alcid |
2003-03-25 |
| 6512675 |
Heat sink grounded to a grounded package lid |
Thomas S. Tarter, Tom Ley, Shrikar Bhagath, Nhon T. Do |
2003-01-28 |
| 6508845 |
Method and apparatus for precoining BGA type packages prior to electrical characterization |
— |
2003-01-21 |
| 6483169 |
Extruded heat spreader |
Edward S. Alcid |
2002-11-19 |
| 6399474 |
Method and apparatus for precoining BGA type packages prior to electrical characterization |
— |
2002-06-04 |
| 5414222 |
Multilayer IC semiconductor package |
Bidyut Sen |
1995-05-09 |
| 5304743 |
Multilayer IC semiconductor package |
Bidyut Sen |
1994-04-19 |
| 4810671 |
Process for bonding die to substrate using a gold/silicon seed |
Bidyut K. Bhattacharyya |
1989-03-07 |
| 4771018 |
Process of attaching a die to a substrate using gold/silicon seed |
Bidyut K. Bhattacharyya |
1988-09-13 |
