Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multilayer IC semiconductor package

Multilayer IC semiconductor package

US Patent 5414222 · Granted May 9, 1995

Estimated economic value: $12,786,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Aggregation of multiplexed optical transceivers in server chassis to establish f2025
Composite connector carrying power, electro-optical data, and fluid input/output2024
Processor socket bridge for input/output extension2023
Interconnect method for implementing scale-up servers2019
Light emitting diode device with reconstituted LED components on substrate2018
Light emitting diode device with reconstituted LED components on substrate2017
Holding of interposers and other microelectronic workpieces in position during a2016
Use of underfill tape in microelectronic components, and microelectronic compone2016
Micro-link high-bandwidth chip-to-chip bus2014
Chip package with channel stiffener frame2013
Apparatus for electrically coupling a semiconductor package to a printed circuit2012
Chip package with channel stiffener frame2011