Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5508228 | Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same | Ernest R. Nolan, Diana C. Duane, Todd H. Herder, Thomas Alan Bishop, Robert W. Froehlich +5 more | 1996-04-16 |
| 5358604 | Method for producing conductive patterns | Charles W. C. Lin, Chung-Ju Lee, Tom J. Hirsch | 1994-10-25 |