Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5508228 | Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same | Ernest R. Nolan, Diana C. Duane, Todd H. Herder, Thomas Alan Bishop, Kimcuc T. Tran +5 more | 1996-04-16 |