Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 5508228 | Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same | Ernest R. Nolan, Todd H. Herder, Thomas Alan Bishop, Kimcuc T. Tran, Robert W. Froehlich +5 more | 1996-04-16 | |
| 5183972 | Copper/epoxy structures | Eric L. Zilley, Robert C. Jordan | 1993-02-02 | $16,362,000 |