Issued Patents All Time
Showing 25 most recent of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10476481 | Acoustic filtering circuitry including capacitor | Alan S. Chen, Benjamin Paul Abbott, Taeho Kook, Scott F. Shive, Jean Briot | 2019-11-12 |
| 10469050 | Guided acoustic wave device | Kevin Gamble, Benjamin Paul Abbott, Alan S. Chen | 2019-11-05 |
| 9973169 | Surface acoustic wave filter with a cap layer for improved reliability | Curtiss Hella, Benjamin Paul Abbott, Daniel Chesire, Chad Thompson, Alan S. Chen | 2018-05-15 |
| 9331667 | Methods, systems, and apparatuses for temperature compensated surface acoustic wave device | Curtiss Hella, Benjamin Paul Abbott, Daniel Chesire, Chad Thompson, Alan S. Chen | 2016-05-03 |
| 9209380 | Acoustic wave device | Suzanne Combe, Alan S. Chen, Charles E. Carpenter, Ian Y. K. Yee, Jean Briot +1 more | 2015-12-08 |
| 8552819 | High coupling, low loss saw filter and associated method | Benjamin Paul Abbott, Alan S. Chen, Taeho Kook, Robert Aigner, Suzanne Combe +3 more | 2013-10-08 |
| 8319343 | Routing under bond pad for the replacement of an interconnect layer | Vance D. Archer, III, Michael AYUKAWA, Mark A. Bachman, Daniel Chesire, Seung H. Kang +2 more | 2012-11-27 |
| 8294331 | Acoustic wave guide device and method for minimizing trimming effects and piston mode instabilities | Benjamin Paul Abbott, Robert Aigner, Alan S. Chen, Julien Gratier, Taeho Kook +1 more | 2012-10-23 |
| 8183698 | Bond pad support structure for semiconductor device | Joze E. Antol, John W. Osenbach | 2012-05-22 |
| 8119501 | Method for separating a semiconductor wafer into individual semiconductor dies using an implanted impurity | Edward B. Harris | 2012-02-21 |
| 8044553 | Temperature compensated surface acoustic wave device and method having buried interdigital transducers for providing an improved insertion loss and quality factor | Alan S. Chen, Taeho Kook, Stephen A. Neston, Timothy Daniel | 2011-10-25 |
| 7678639 | Inductor formed in an integrated circuit | Edward B. Harris, Sailesh Mansinh Merchant, Susan Clay Vitkavage | 2010-03-16 |
| 7566964 | Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structures | Seung H. Kang, Roland Krebs, Michael AYUKAWA, Sailesh Mansinh Merchant | 2009-07-28 |
| 7541238 | Inductor formed in an integrated circuit | Edward B. Harris, Sailesh Mansinh Merchant, Susan Clay Vitkavage | 2009-06-02 |
| 7332775 | Protruding spacers for self-aligned contacts | Gerald W. Gibson, Eduardo Jose Quinones | 2008-02-19 |
| 7126198 | Protruding spacers for self-aligned contacts | Gerald W. Gibson, Eduardo Jose Quinones | 2006-10-24 |
| 7081419 | Gate dielectric structure for reducing boron penetration and current leakage | Yuan-Feng Chen, Feng Li, Yi Ma | 2006-07-25 |
| 7068139 | Inductor formed in an integrated circuit | Edward B. Harris, Sailesh Mansinh Merchant, Susan Clay Vitkavage | 2006-06-27 |
| 7067419 | Mask layer and dual damascene interconnect structure in a semiconductor device | Robert Huang, Scott Jessen, Subramanian Karthikeyan, Joshua Li, Isaiah O. Oladeji +1 more | 2006-06-27 |
| 6960836 | Reinforced bond pad | Mark A. Bachman, Daniel Chesire, Sailesh Mansinh Merchant, John W. Osenbach | 2005-11-01 |
| 6879046 | Split barrier layer including nitrogen-containing portion and oxygen-containing portion | Gerald W. Gibson, Scott Jessen, Steven Alan Lytle, Susan Clay Vitkavage | 2005-04-12 |
| 6869873 | Copper silicide passivation for improved reliability | Robert W. Bradshaw, Daniele Gilkes, Sailesh Mansinh Merchant, Deepak A. Ramappa | 2005-03-22 |
| 6798043 | Structure and method for isolating porous low-k dielectric films | Susan Clay Vitkavage, Steve Lytle, Gerald W. Gibson, Scott Jessen | 2004-09-28 |
| 6675631 | Method for conducting crash tests using a carriage and corresponding device | Hermann Steffan, Andreas Moser, Manfred Hofinger, Bertram Christian Geigl, Erich Mayrhofer +2 more | 2004-01-13 |
| 6576980 | Surface treatment anneal of hydrogenated silicon-oxy-carbide dielectric layer | Huili Shao, Susan Clay Vitkavage | 2003-06-10 |