Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9973169 | Surface acoustic wave filter with a cap layer for improved reliability | Kurt G. Steiner, Curtiss Hella, Benjamin Paul Abbott, Chad Thompson, Alan S. Chen | 2018-05-15 |
| 9331667 | Methods, systems, and apparatuses for temperature compensated surface acoustic wave device | Kurt G. Steiner, Curtiss Hella, Benjamin Paul Abbott, Chad Thompson, Alan S. Chen | 2016-05-03 |
| 8319343 | Routing under bond pad for the replacement of an interconnect layer | Vance D. Archer, III, Michael AYUKAWA, Mark A. Bachman, Seung H. Kang, Taeho Kook +2 more | 2012-11-27 |
| 7973544 | Thermal monitoring and management of integrated circuits | Vance D. Archer, III, Warren K. Gladden, Seung H. Kang, Taeho Kook, Sailesh Mansinh Merchant +1 more | 2011-07-05 |
| 7777333 | Structure and method for fabricating flip chip devices | Mark A. Bachman, Donald S. Bitting, Taeho Kook, Sailesh Mansinh Merchant | 2010-08-17 |
| 7476951 | Selective isotropic etch for titanium-based materials | Timothy Campbell, Kelly Hinckley, Gregory A. Head, Benu B. Patel | 2009-01-13 |
| 7429502 | Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink | Vance D. Archer, III, Kouros Azimi, Warren K. Gladden, Seung H. Kang, Taeho Kook +2 more | 2008-09-30 |
| 7397103 | Semiconductor with damage detection circuitry | Vance D. Archer, III, Seung H. Kang, Taeho Kook, Sailesh Mansinh Merchant | 2008-07-08 |
| 7328830 | Structure and method for bonding to copper interconnect structures | Mark A. Bachman, Sailesh Mansinh Merchant | 2008-02-12 |
| 7327029 | Integrated circuit device incorporating metallurigical bond to enhance thermal conduction to a heat sink | Vance D. Archer, III, Kouros Azimi, Warren K. Gladden, Seung H. Kang, Taeho Kook +2 more | 2008-02-05 |
| 7301231 | Reinforced bond pad for a semiconductor device | Joze E. Antol, Philip William Seitzer, Rafe Carl Mengel, Vance D. Archer, III, Thomas B. Gans +2 more | 2007-11-27 |
| 7221173 | Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process | Mark A. Bachman, Taeho Kook, Sailesh Mansinh Merchant | 2007-05-22 |
| 7115985 | Reinforced bond pad for a semiconductor device | Joze E. Antol, Philip William Seitzer, Rafe Carl Mengel, Vance D. Archer, III, Thomas B. Gans +2 more | 2006-10-03 |
| 7078337 | Selective isotropic etch for titanium-based materials | Timothy Campbell, Kelly Hinckley, Gregory A. Head, Benu B. Patel | 2006-07-18 |
| 6960836 | Reinforced bond pad | Mark A. Bachman, Sailesh Mansinh Merchant, John W. Osenbach, Kurt G. Steiner | 2005-11-01 |
| 6153543 | High density plasma passivation layer and method of application | Edward P. Martin, Jr., Leonard J. Olmer, Barbara Kotzias, Rafael N. Barba | 2000-11-28 |
| 5264377 | Integrated circuit electromigration monitor | Anthony Oates | 1993-11-23 |