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Routing under bond pad for the replacement of an interconnect layer |
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Thermal monitoring and management of integrated circuits |
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Structure and method for fabricating flip chip devices |
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2010-08-17 |
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Selective isotropic etch for titanium-based materials |
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2009-01-13 |
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Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink |
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2008-09-30 |
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Semiconductor with damage detection circuitry |
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2008-07-08 |
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Structure and method for bonding to copper interconnect structures |
Mark A. Bachman, Sailesh Mansinh Merchant |
2008-02-12 |
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Integrated circuit device incorporating metallurigical bond to enhance thermal conduction to a heat sink |
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Reinforced bond pad for a semiconductor device |
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2007-11-27 |
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2007-05-22 |
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Reinforced bond pad for a semiconductor device |
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Reinforced bond pad |
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High density plasma passivation layer and method of application |
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Integrated circuit electromigration monitor |
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