| 9973169 |
Surface acoustic wave filter with a cap layer for improved reliability |
Kurt G. Steiner, Curtiss Hella, Benjamin Paul Abbott, Chad Thompson, Alan S. Chen |
2018-05-15 |
$9,777,000 |
| 9331667 |
Methods, systems, and apparatuses for temperature compensated surface acoustic wave device |
Kurt G. Steiner, Curtiss Hella, Benjamin Paul Abbott, Chad Thompson, Alan S. Chen |
2016-05-03 |
|
| 8319343 |
Routing under bond pad for the replacement of an interconnect layer |
Vance D. Archer, III, Michael AYUKAWA, Mark A. Bachman, Seung H. Kang, Taeho Kook +2 more |
2012-11-27 |
|
| 7973544 |
Thermal monitoring and management of integrated circuits |
Vance D. Archer, III, Warren K. Gladden, Seung H. Kang, Taeho Kook, Sailesh Mansinh Merchant +1 more |
2011-07-05 |
|
| 7777333 |
Structure and method for fabricating flip chip devices |
Mark A. Bachman, Donald S. Bitting, Taeho Kook, Sailesh Mansinh Merchant |
2010-08-17 |
|
| 7476951 |
Selective isotropic etch for titanium-based materials |
Timothy Campbell, Kelly Hinckley, Gregory A. Head, Benu B. Patel |
2009-01-13 |
|
| 7429502 |
Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink |
Vance D. Archer, III, Kouros Azimi, Warren K. Gladden, Seung H. Kang, Taeho Kook +2 more |
2008-09-30 |
|
| 7397103 |
Semiconductor with damage detection circuitry |
Vance D. Archer, III, Seung H. Kang, Taeho Kook, Sailesh Mansinh Merchant |
2008-07-08 |
|
| 7328830 |
Structure and method for bonding to copper interconnect structures |
Mark A. Bachman, Sailesh Mansinh Merchant |
2008-02-12 |
|
| 7327029 |
Integrated circuit device incorporating metallurigical bond to enhance thermal conduction to a heat sink |
Vance D. Archer, III, Kouros Azimi, Warren K. Gladden, Seung H. Kang, Taeho Kook +2 more |
2008-02-05 |
|
| 7301231 |
Reinforced bond pad for a semiconductor device |
Joze E. Antol, Philip William Seitzer, Rafe Carl Mengel, Vance D. Archer, III, Thomas B. Gans +2 more |
2007-11-27 |
|
| 7221173 |
Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process |
Mark A. Bachman, Taeho Kook, Sailesh Mansinh Merchant |
2007-05-22 |
|
| 7115985 |
Reinforced bond pad for a semiconductor device |
Joze E. Antol, Philip William Seitzer, Rafe Carl Mengel, Vance D. Archer, III, Thomas B. Gans +2 more |
2006-10-03 |
$4,563,000 |
| 7078337 |
Selective isotropic etch for titanium-based materials |
Timothy Campbell, Kelly Hinckley, Gregory A. Head, Benu B. Patel |
2006-07-18 |
$2,326,000 |
| 6960836 |
Reinforced bond pad |
Mark A. Bachman, Sailesh Mansinh Merchant, John W. Osenbach, Kurt G. Steiner |
2005-11-01 |
$11,315,000 |
| 6153543 |
High density plasma passivation layer and method of application |
Edward P. Martin, Jr., Leonard J. Olmer, Barbara Kotzias, Rafael N. Barba |
2000-11-28 |
$25,880,000 |
| 5264377 |
Integrated circuit electromigration monitor |
Anthony Oates |
1993-11-23 |
|