Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8507317 | Solder bump structure for flip chip semiconductor devices and method of manufacturing therefore | Mark A. Bachman, Sailesh Chittipeddi, Seung H. Kang, Sailesh Mansinh Merchant | 2013-08-13 |
| 8259454 | Interconnect structure including hybrid frame panel | Raymond Albert Fillion, Daniel Lee Abraham | 2012-09-04 |
| 7952206 | Solder bump structure for flip chip semiconductor devices and method of manufacture therefore | Mark A. Bachman, Sailesh Chittipeddi, Seung H. Kang, Sailesh Mansinh Merchant | 2011-05-31 |
| 7777333 | Structure and method for fabricating flip chip devices | Mark A. Bachman, Daniel Chesire, Taeho Kook, Sailesh Mansinh Merchant | 2010-08-17 |
| 6917749 | Polymer optical waveguides on polymer substrates | Renyuan Gao, Robert M. Mininni, Robert A. Norwood, Kazuya Takayama, Anthony F. Garito | 2005-07-12 |
| 6603917 | Planar optical waveguide with core barrier | Kazuya Takayama, Robert A. Norwood | 2003-08-05 |
| 5955381 | Integrated circuit fabrication | Thomas Craig Esry, David Huibregtse, Paul Wheeler | 1999-09-21 |