Issued Patents All Time
Showing 1–25 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749909 | Phased array antenna with isotropic and non-isotropic radiating and omnidirectional and non-omnidirectional receiving elements | — | 2023-09-05 |
| 11539144 | Phased array antenna with isotropic and non-isotropic radiating and omnidirectional and non-omnidirectional receiving elements | — | 2022-12-27 |
| 11411324 | Phased array antenna with isotropic and non-isotropic radiating and omnidirectional and non-omnidirectional receiving elements | — | 2022-08-09 |
| 10892231 | Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof | Christopher James Kapusta, Risto Tuominen, Kaustubh Ravindra Nagarkar | 2021-01-12 |
| 10838059 | Acoustic phased array antenna with isotropic and non-isotropic radiating elements | — | 2020-11-17 |
| 10804116 | Electronics package with integrated interconnect structure and method of manufacturing thereof | Christopher James Kapusta, Risto Tuominen, Kaustubh Ravindra Nagarkar | 2020-10-13 |
| 10804115 | Electronics package with integrated interconnect structure and method of manufacturing thereof | Christopher James Kapusta, Risto Tuominen, Kaustubh Ravindra Nagarkar | 2020-10-13 |
| 10692737 | Multilayer interconnect structure with buried conductive via connections and method of manufacturing thereof | Kaustubh Ravindra Nagarkar | 2020-06-23 |
| 10566301 | Semiconductor logic device and system and method of embedded packaging of same | Kaustubh Ravindra Nagarkar | 2020-02-18 |
| 10541209 | Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof | Christopher James Kapusta, Risto Tuominen, Kaustubh Ravindra Nagarkar | 2020-01-21 |
| 10541153 | Electronics package with integrated interconnect structure and method of manufacturing thereof | Christopher James Kapusta, Risto Tuominen, Kaustubh Ravindra Nagarkar | 2020-01-21 |
| 10504826 | Device almost last embedded device structure and method of manufacturing thereof | Kaustubh Ravindra Nagarkar | 2019-12-10 |
| 10497648 | Embedded electronics package with multi-thickness interconnect structure and method of making same | — | 2019-12-03 |
| 10396053 | Semiconductor logic device and system and method of embedded packaging of same | Kaustubh Ravindra Nagarkar | 2019-08-27 |
| 10332832 | Method of manufacturing an electronics package using device-last or device-almost last placement | Christopher James Kapusta, Risto Tuominen, Kaustubh Ravindra Nagarkar | 2019-06-25 |
| 10276523 | Semiconductor logic device and system and method of embedded packaging of same | Kaustubh Ravindra Nagarkar | 2019-04-30 |
| 10211141 | Semiconductor logic device and system and method of embedded packaging of same | Kaustubh Ravindra Nagarkar | 2019-02-19 |
| 9953917 | Electronics package with embedded through-connect and resistor structure and method of manufacturing thereof | Arun Virupaksha Gowda, Paul Alan McConnelee | 2018-04-24 |
| 9953913 | Electronics package with embedded through-connect structure and method of manufacturing thereof | Arun Virupaksha Gowda, Paul Alan McConnelee | 2018-04-24 |
| 9953910 | Demountable interconnect structure | Charles G. Woychik | 2018-04-24 |
| 9610758 | Method of making demountable interconnect structure | Charles G. Woychik | 2017-04-04 |
| 9000496 | Source bridge for cooling and/or external connection | Peter N. Bronecke, Joshua Isaac Wright, Jesse Berkley Tucker, Laura Meyer | 2015-04-07 |
| 8674212 | Solar cell and magnetically self-assembled solar cell assembly | William Hullinger Huber, Charles Stephen Korman, Anil Raj Duggal, William Edward Burdick, Jr. | 2014-03-18 |
| 8498131 | Interconnect structure | Kevin Matthew Durocher, Richard Joseph Saia, Charles G. Woychik | 2013-07-30 |
| 8466007 | Power semiconductor module and fabrication method | Eladio Clemente Delgado, Richard Alfred Beaupre, Stephen Daley Arthur, Ernest Wayne Balch, Kevin Matthew Durocher +1 more | 2013-06-18 |