Issued Patents All Time
Showing 25 most recent of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322916 | Electronic connection assembly | David Richard Esler, Arun Virupaksha Gowda, Brian Magann Rush, Liang Yin, Richard Anthony Eddins +2 more | 2025-06-03 |
| 11982645 | Sensor system and method | Joseph Alfred Iannotti, David Richard Esler | 2024-05-14 |
| 11950394 | Liquid-cooled assembly and method | Brian Magann Rush, David Richard Esler, Liang Yin, Richard Anthony Eddins, Judd Everett Swanson +1 more | 2024-04-02 |
| 11824030 | Mechanical punched via formation in electronics package and electronics package formed thereby | Youichi Nishihara | 2023-11-21 |
| 11630086 | Sensor system and method | Joseph Alfred Iannotti, David Richard Esler | 2023-04-18 |
| 11551993 | Power overlay module and method of assembling | David Richard Esler, Arun Virupaksha Gowda, Weijun Yin, Liqiang Yang, Richard Anthony Eddins | 2023-01-10 |
| 11538769 | High voltage semiconductor devices having improved electric field suppression | Stephen Daley Arthur, Liangchun Yu, Nancy Cecelia Stoffel, David Richard Esler | 2022-12-27 |
| 11499545 | Systems and methods for piston rod monitoring | Joseph Alfred Iannotti, Marco Francesco Aimi | 2022-11-15 |
| 11503704 | Systems and methods for hybrid glass and organic packaging for radio frequency electronics | Stanton Earl Weaver, Joseph Alfred Iannotti | 2022-11-15 |
| 11398445 | Mechanical punched via formation in electronics package and electronics package formed thereby | Youichi Nishihara | 2022-07-26 |
| 11309304 | Stackable electronic package and method of fabricating same | James Sabatini, Glenn Forman | 2022-04-19 |
| 11079359 | Sensor system and method | Joseph Alfred Iannotti, David Richard Esler | 2021-08-03 |
| 10957832 | Electronics package for light emitting semiconductor devices and method of manufacturing thereof | Risto Tuominen, Kaustubh Ravindra Nagarkar | 2021-03-23 |
| 10892237 | Methods of fabricating high voltage semiconductor devices having improved electric field suppression | Stephen Daley Arthur, Liangchun Yu, Nancy Cecelia Stoffel, David Richard Esler | 2021-01-12 |
| 10892231 | Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof | Raymond Albert Fillion, Risto Tuominen, Kaustubh Ravindra Nagarkar | 2021-01-12 |
| 10804174 | Non-magnetic package and method of manufacture | Marco Francesco Aimi | 2020-10-13 |
| 10804116 | Electronics package with integrated interconnect structure and method of manufacturing thereof | Raymond Albert Fillion, Risto Tuominen, Kaustubh Ravindra Nagarkar | 2020-10-13 |
| 10804115 | Electronics package with integrated interconnect structure and method of manufacturing thereof | Raymond Albert Fillion, Risto Tuominen, Kaustubh Ravindra Nagarkar | 2020-10-13 |
| 10784576 | True time delay beam former module and method of making the same | Joseph Alfred Iannotti | 2020-09-22 |
| 10770382 | Low inductance stackable solid-state switching module and method of manufacturing thereof | Ramanujam Ramabhadran, Kum Kang Huh, Brian Lynn Rowden, Glenn Scott Claydon, Ahmed Elasser | 2020-09-08 |
| 10660208 | Embedded dry film battery module and method of manufacturing thereof | Kaustubh Ravindra Nadarkar | 2020-05-19 |
| 10607929 | Electronics package having a self-aligning interconnect assembly and method of making same | Kaustubh Ravindra Nagarkar, Arun Virupaksha Gowda, James Wilson Rose | 2020-03-31 |
| 10605785 | Sensor system and method | Joseph Alfred Iannotti, David Richard Esler | 2020-03-31 |
| 10541209 | Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof | Raymond Albert Fillion, Risto Tuominen, Kaustubh Ravindra Nagarkar | 2020-01-21 |
| 10541153 | Electronics package with integrated interconnect structure and method of manufacturing thereof | Raymond Albert Fillion, Risto Tuominen, Kaustubh Ravindra Nagarkar | 2020-01-21 |