Issued Patents All Time
Showing 1–25 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11792941 | Circuit board structure and method for manufacturing a circuit board structure | Antti Iihola, Petteri Palm | 2023-10-17 |
| 11177204 | Power electronics package and method of manufacturing thereof | Arun Virupaksha Gowda, Paul Alan McConnelee, Nancy Cecelia Stoffel | 2021-11-16 |
| 11134572 | Circuit board structure and method for manufacturing a circuit board structure | Antti Iihola, Petteri Palm | 2021-09-28 |
| 11071207 | Electronic module | Petteri Palm | 2021-07-20 |
| 10957832 | Electronics package for light emitting semiconductor devices and method of manufacturing thereof | Christopher James Kapusta, Kaustubh Ravindra Nagarkar | 2021-03-23 |
| 10892231 | Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof | Christopher James Kapusta, Raymond Albert Fillion, Kaustubh Ravindra Nagarkar | 2021-01-12 |
| 10804115 | Electronics package with integrated interconnect structure and method of manufacturing thereof | Christopher James Kapusta, Raymond Albert Fillion, Kaustubh Ravindra Nagarkar | 2020-10-13 |
| 10804116 | Electronics package with integrated interconnect structure and method of manufacturing thereof | Christopher James Kapusta, Raymond Albert Fillion, Kaustubh Ravindra Nagarkar | 2020-10-13 |
| 10770444 | Electronics package having a multi-thickness conductor layer and method of manufacturing thereof | Arun Virupaksha Gowda | 2020-09-08 |
| 10765006 | Electronic module | Petteri Palm | 2020-09-01 |
| 10700035 | Stacked electronics package and method of manufacturing thereof | Arun Virupaksha Gowda | 2020-06-30 |
| 10553556 | Electronics package having a multi-thickness conductor layer and method of manufacturing thereof | Arun Virupaksha Gowda | 2020-02-04 |
| 10541153 | Electronics package with integrated interconnect structure and method of manufacturing thereof | Christopher James Kapusta, Raymond Albert Fillion, Kaustubh Ravindra Nagarkar | 2020-01-21 |
| 10541209 | Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof | Christopher James Kapusta, Raymond Albert Fillion, Kaustubh Ravindra Nagarkar | 2020-01-21 |
| 10470346 | Electronic module with EMI protection | — | 2019-11-05 |
| 10453786 | Power electronics package and method of manufacturing thereof | Arun Virupaksha Gowda, Paul Alan McConnelee, Nancy Cecelia Stoffel | 2019-10-22 |
| 10332832 | Method of manufacturing an electronics package using device-last or device-almost last placement | Christopher James Kapusta, Raymond Albert Fillion, Kaustubh Ravindra Nagarkar | 2019-06-25 |
| 10312194 | Stacked electronics package and method of manufacturing thereof | Arun Virupaksha Gowda | 2019-06-04 |
| 10141251 | Electronic packages with pre-defined via patterns and methods of making and using the same | Arun Virupaksha Gowda, Paul Alan McConnelee | 2018-11-27 |
| 10085347 | Manufacture of a circuit board and circuit board containing a component | Petteri Palm, Antti Iihola | 2018-09-25 |
| 10085345 | Electronic module | Petteri Palm | 2018-09-25 |
| 10010019 | Electronic module with EMI protection | — | 2018-06-26 |
| 9999136 | Method for fabrication of an electronic module and electronic module | — | 2018-06-12 |
| 9966371 | Electronics package having a multi-thickness conductor layer and method of manufacturing thereof | Arun Virupaksha Gowda | 2018-05-08 |
| 9966361 | Electronics package having a multi-thickness conductor layer and method of manufacturing thereof | Arun Virupaksha Gowda | 2018-05-08 |