Issued Patents All Time
Showing 1–25 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322916 | Electronic connection assembly | Christopher James Kapusta, David Richard Esler, Brian Magann Rush, Liang Yin, Richard Anthony Eddins +2 more | 2025-06-03 |
| 12237243 | Power overlay module with thermal storage | Rinaldo Luigi Miorini, Naveenan Thiagarajan, Brian Magann Rush | 2025-02-25 |
| 12034033 | Semiconductor device package and method of forming | — | 2024-07-09 |
| 11605609 | Ultra-thin embedded semiconductor device package and method of manufacturing thereof | Paul Alan McConnelee, Shakti Singh Chauhan | 2023-03-14 |
| 11551993 | Power overlay module and method of assembling | David Richard Esler, Christopher James Kapusta, Weijun Yin, Liqiang Yang, Richard Anthony Eddins | 2023-01-10 |
| 11177204 | Power electronics package and method of manufacturing thereof | Paul Alan McConnelee, Nancy Cecelia Stoffel, Risto Tuominen | 2021-11-16 |
| 10770444 | Electronics package having a multi-thickness conductor layer and method of manufacturing thereof | Risto Tuominen | 2020-09-08 |
| 10700035 | Stacked electronics package and method of manufacturing thereof | Risto Tuominen | 2020-06-30 |
| RE48015 | Interconnect devices for electronic packaging assemblies | Gamal Refai-Ahmed, David Mulford Shaddock, John Anthony Vogel, Christian M. Giovanniello | 2020-05-26 |
| 10607929 | Electronics package having a self-aligning interconnect assembly and method of making same | Christopher James Kapusta, Kaustubh Ravindra Nagarkar, James Wilson Rose | 2020-03-31 |
| 10607957 | Ultra-thin embedded semiconductor device package and method of manufacturing thereof | Paul Alan McConnelee, Shakti Singh Chauhan | 2020-03-31 |
| 10553556 | Electronics package having a multi-thickness conductor layer and method of manufacturing thereof | Risto Tuominen | 2020-02-04 |
| 10453786 | Power electronics package and method of manufacturing thereof | Paul Alan McConnelee, Nancy Cecelia Stoffel, Risto Tuominen | 2019-10-22 |
| 10312194 | Stacked electronics package and method of manufacturing thereof | Risto Tuominen | 2019-06-04 |
| 10269688 | Power overlay structure and method of making same | Paul Alan McConnelee, Shakti Singh Chauhan | 2019-04-23 |
| 10204881 | Power overlay structure and reconstituted semiconductor wafer having wirebonds | Paul Alan McConnelee | 2019-02-12 |
| 10186477 | Power overlay structure and method of making same | Paul Alan McConnelee, Shakti Singh Chauhan | 2019-01-22 |
| 10163773 | Electronics package having a self-aligning interconnect assembly and method of making same | Christopher James Kapusta, Kaustubh Ravindra Nagarkar, James Wilson Rose | 2018-12-25 |
| 10141203 | Electrical interconnect structure for an embedded electronics package | Paul Alan McConnelee | 2018-11-27 |
| 10141251 | Electronic packages with pre-defined via patterns and methods of making and using the same | Paul Alan McConnelee, Risto Tuominen | 2018-11-27 |
| 10070531 | Overlay circuit structure for interconnecting light emitting semiconductors | Donald Paul Cunningham, Shakti Singh Chauhan | 2018-09-04 |
| 10068879 | Three-dimensional stacked integrated circuit devices and methods of assembling the same | — | 2018-09-04 |
| 9966371 | Electronics package having a multi-thickness conductor layer and method of manufacturing thereof | Risto Tuominen | 2018-05-08 |
| 9966361 | Electronics package having a multi-thickness conductor layer and method of manufacturing thereof | Risto Tuominen | 2018-05-08 |
| 9953913 | Electronics package with embedded through-connect structure and method of manufacturing thereof | Raymond Albert Fillion, Paul Alan McConnelee | 2018-04-24 |