Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11605609 | Ultra-thin embedded semiconductor device package and method of manufacturing thereof | Arun Virupaksha Gowda, Paul Alan McConnelee | 2023-03-14 |
| 10667429 | Integrated heat exchange assembly and an associated method thereof | Hendrik Pieter Jacobus de Bock, Graham Charles Kirk, Stanton Earl Weaver, David S. Slaton, Tao Deng +1 more | 2020-05-26 |
| 10631410 | Stacked printed circuit board packages | Corey S. Provencher, Meng Chi Lee, Derek Walters, Ian A. Spraggs, Flynn Carson +9 more | 2020-04-21 |
| 10607957 | Ultra-thin embedded semiconductor device package and method of manufacturing thereof | Arun Virupaksha Gowda, Paul Alan McConnelee | 2020-03-31 |
| 10535611 | Substrate-less integrated components | Flynn Carson, Jun Chung Hsu, Meng Chi Lee | 2020-01-14 |
| 10522475 | Vertical interconnects for self shielded system in package (SiP) modules | Meng Chi Lee, Flynn Carson, Jun Chung Hsu, Tha-An Lin | 2019-12-31 |
| 10517003 | Systems and methods for maintaining service on multiple SIMs in a wireless communication device operating in a multi-SIM multi-standby (MSMS) mode | Ashish Bhardwaj, Manjunatha Subbamma Ananda, Venkateswarlu Bandaru | 2019-12-24 |
| 10269688 | Power overlay structure and method of making same | Arun Virupaksha Gowda, Paul Alan McConnelee | 2019-04-23 |
| 10186477 | Power overlay structure and method of making same | Arun Virupaksha Gowda, Paul Alan McConnelee | 2019-01-22 |
| 10147685 | System-in-package devices with magnetic shielding | Phillip R. Sommer, Shankar S. Pennathur, Meng Chi Lee, Yanfeng Chen | 2018-12-04 |
| 10115677 | Vertical interconnects for self shielded system in package (SiP) modules | Meng Chi Lee, Flynn Carson, Jun Chung Hsu, Tha-An Lin | 2018-10-30 |
| 10109593 | Self shielded system in package (SiP) modules | Meng Chi Lee, Flynn Carson, Jun Chung Hsu, Tha-An Lin | 2018-10-23 |
| 10070531 | Overlay circuit structure for interconnecting light emitting semiconductors | Arun Virupaksha Gowda, Donald Paul Cunningham | 2018-09-04 |
| 9806051 | Ultra-thin embedded semiconductor device package and method of manufacturing thereof | Arun Virupaksha Gowda, Paul Alan McConnelee | 2017-10-31 |
| 9721903 | Vertical interconnects for self shielded system in package (SiP) modules | Meng Chi Lee, Flynn Carson, Jun Chung Hsu, Tha-An Lin | 2017-08-01 |
| 9704788 | Power overlay structure and method of making same | Arun Virupaksha Gowda, Paul Alan McConnelee | 2017-07-11 |
| 9615486 | Thermal interface devices | Hendrik Pieter Jacobus de Bock, Jay Todd Labhart, Graham Charles Kirk, Joo-Han Kim | 2017-04-04 |
| 9534855 | High specific area composite foam and an associated method of fabrication | Kaustubh Ravindra Nagarkar, Matthew Jeremiah Misner, Faisal R. Ahmad | 2017-01-03 |
| 9391027 | Embedded semiconductor device package and method of manufacturing thereof | Paul Alan McConnelee, Arun Virupaksha Gowda | 2016-07-12 |
| 9370090 | Circuit card assembly and method of manufacturing thereof | Stuart Connolly, Binoy Milan Shah, Brian Hoden, Joo-Han Kim | 2016-06-14 |
| 9333599 | Electronics chassis and method of fabricating the same | Hendrik Pieter Jacobus de Bock, Stanton Earl Weaver, Tao Deng, Jay Todd Labhart, Pramod Chamarthy +2 more | 2016-05-10 |
| 9299630 | Diffusion barrier for surface mount modules | Arun Virupaksha Gowda, Paul Alan McConnelee, Ri-an Zhao | 2016-03-29 |
| 9253871 | Circuit card assembly and method of fabricating the same | Joo-Han Kim, Hendrik Pieter Jacobus de Bock, Jay Todd Labhart, Graham Charles Kirk, Stuart Connolly | 2016-02-02 |
| 9209151 | Embedded semiconductor device package and method of manufacturing thereof | Paul Alan McConnelee, Arun Virupaksha Gowda | 2015-12-08 |
| 9184124 | Reliable surface mount integrated power module | Arun Virupaksha Gowda, Paul Alan McConnelee | 2015-11-10 |