| 12266846 |
System packaging for millimeter wave antennas |
Sidharth Dalmia, Wansuk Yun |
2025-04-01 |
|
| 12165956 |
Molded silicon on passive package |
Kumar Nagarajan, Karthik Shanmugam, Menglu Li, Raymundo M. Camenforte, Scott D. Morrison |
2024-12-10 |
$286,613,000 |
| 12107283 |
Cell packaging techniques |
Angelo V. Marasco, Nathan J. Bohney, John M. McCambridge, Antonio Manenti, Laura Mayer +2 more |
2024-10-01 |
$316,155,000 |
| 12074077 |
Flexible package architecture concept in fanout |
Karthik Shanmugam, Jun Zhai, Raymundo M. Camenforte, Menglu Li |
2024-08-27 |
$283,265,000 |
| 11395408 |
Wafer-level passive array packaging |
Scott D. Morrison, Karthik Shanmugam, Raymundo M. Camenforte, Rakshit Agrawal, Kiranjit Dhaliwal |
2022-07-19 |
$234,734,000 |
| 10991659 |
Substrate-less integrated components |
Jun Chung Hsu, Meng Chi Lee, Shatki S. Chauhan |
2021-04-27 |
$300,345,000 |
| 10643952 |
Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die |
Reza A. Pagaila, Seung Uk Yoon |
2020-05-05 |
|
| 10631410 |
Stacked printed circuit board packages |
Corey S. Provencher, Meng Chi Lee, Derek Walters, Ian A. Spraggs, Shakti Singh Chauhan +9 more |
2020-04-21 |
$110,357,000 |
| 10535611 |
Substrate-less integrated components |
Jun Chung Hsu, Meng Chi Lee, Shakti Singh Chauhan |
2020-01-14 |
$151,925,000 |
| 10522475 |
Vertical interconnects for self shielded system in package (SiP) modules |
Meng Chi Lee, Shakti Singh Chauhan, Jun Chung Hsu, Tha-An Lin |
2019-12-31 |
$109,024,000 |
| 10115677 |
Vertical interconnects for self shielded system in package (SiP) modules |
Meng Chi Lee, Shakti Singh Chauhan, Jun Chung Hsu, Tha-An Lin |
2018-10-30 |
$119,981,000 |
| 10109593 |
Self shielded system in package (SiP) modules |
Meng Chi Lee, Shakti Singh Chauhan, Jun Chung Hsu, Tha-An Lin |
2018-10-23 |
$108,278,000 |
| 9899239 |
Carrier ultra thin substrate |
Jun Chung Hsu, Kwan-Yu Lai |
2018-02-20 |
$98,367,000 |
| 9721903 |
Vertical interconnects for self shielded system in package (SiP) modules |
Meng Chi Lee, Shakti Singh Chauhan, Jun Chung Hsu, Tha-An Lin |
2017-08-01 |
$97,661,000 |
| 9679801 |
Dual molded stack TSV package |
Kwan-Yu Lai, Jun Zhai, Kunzhong Hu |
2017-06-13 |
$53,900,000 |
| 9589936 |
3D integration of fanout wafer level packages |
Jun Zhai, Kunzhong Hu |
2017-03-07 |
$87,942,000 |
| 9484279 |
Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die |
Reza A. Pagaila, Seung Uk Yoon |
2016-11-01 |
|
| 9331007 |
Semiconductor device and method of forming conductive ink layer as interconnect structure between semiconductor packages |
InSang Yoon, Il Kwon Shim, SeongHun Mun |
2016-05-03 |
|
| 9236319 |
Stacked integrated circuit package system |
Jong-Woo Ha, BumJoon Hong, Seongmin Lee |
2016-01-12 |
|
| 8723302 |
Integrated circuit package system with input/output expansion |
Harry Chandra |
2014-05-13 |
|
| 8598690 |
Semiconductor device having conductive vias in peripheral region connecting shielding layer to ground |
Harry Chandra |
2013-12-03 |
|
| 8409920 |
Integrated circuit package system for package stacking and method of manufacture therefor |
Rajendra D. Pendse, Il Kwon Shim, Seng Guan Chow |
2013-04-02 |
|
| 8241965 |
Integrated circuit packaging system with pad connection and method of manufacture thereof |
Henry Descalzo Bathan, Zigmund Ramirez Camacho, Emmanuel Espiritu |
2012-08-14 |
|
| 8129832 |
Mountable integrated circuit package system with substrate having a conductor-free recess |
In Sang Yoon, Seongmin Lee, JoHyun Bae |
2012-03-06 |
|
| 8110441 |
Method of electrically connecting a shielding layer to ground through a conductive via disposed in peripheral region around semiconductor die |
Harry Chandra |
2012-02-07 |
|
