Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of electrically connecting a shielding layer to ground through a conductive via disposed in peripheral region around semiconductor die

Method of electrically connecting a shielding layer to ground through a conductive via disposed in peripheral region around semiconductor die

US Patent 8110441 · Granted Feb 7, 2012

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System packaging for millimeter wave antennas2025
Molded silicon on passive package2024
Cell packaging techniques2024
Flexible package architecture concept in fanout2024
Wafer-level passive array packaging2022
Integrated circuit package having a low profile2021
Substrate-less integrated components2021
Semiconductor device and method of forming EMI shielding layer with conductive m2020
Stacked printed circuit board packages2020
Substrate-less integrated components2020
Vertical interconnects for self shielded system in package (SiP) modules2019
Vertical interconnects for self shielded system in package (SiP) modules2018