Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10991644 | Integrated circuit package having a low profile | Paul A. David, William P. Taylor | 2021-04-27 |
| 8723302 | Integrated circuit package system with input/output expansion | Flynn Carson | 2014-05-13 |
| 8653654 | Integrated circuit packaging system with a stackable package and method of manufacture thereof | Robert J. Martin | 2014-02-18 |
| 8598690 | Semiconductor device having conductive vias in peripheral region connecting shielding layer to ground | Flynn Carson | 2013-12-03 |
| 8110441 | Method of electrically connecting a shielding layer to ground through a conductive via disposed in peripheral region around semiconductor die | Flynn Carson | 2012-02-07 |